I'm considering the ADC3101 for an update to the MM WALL2 design. The part will only consume about 20mW in our application; it won't need the thermal slug's high theta capability. I'd prefer not to solder the thermal slug under the part and be able to make that board real estate available for routing.
Kyle was good enough to post this on my behalf.
To clarify, my question is: must I connect the thermal slug to ground for full, proper operation of the ADC3101? thanks
We highly recommend soldering the pad down for mechanical rigidity of the system. Otherwise, the lead tips of the QFN may get stressed, resulting in wire bond breakage.
Tying the pad to ground is good, that will ground the substrate, potentially reducing noise in your system.
Audio Applications Engineering Manager
Dallas, TX USA
Good answer. Would this advice also apply to the AIC26? Are the two issues more or less severe for the AIC26 vs. the ADC3101? thanks, Chris
Yes, this applies for any codec with thermal pad.
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