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TLV320AIC3254

Other Parts Discussed in Thread: TLV320AIC32, TLV320AIC3254

Hello 

For one of my application i will be using TLV320AIC32 codec interfaced with a radio module. MEMS microphones with I2S digital output are used in the application. 

I am considering the architecture, with RF module as I2S master and codec & MEMS sensors with I2S output  as slaves .

please advise the feasibility of the I2S architecture.

Arvind

 

  • Hello, Arvind,

    Welcome to E2E and thank you for your interest in our products!

    The TLV320AIC3254 like many of our audio converters is capable to be connected to multiple devices that support I2S interface. This device supports TDM mode, so it is even possible to share the same data lines. Finally, the I2S lines can work in full-duplex mode. So, the codec can receive and send data simultaneously.

    Please let me know if you have additional questions or comments about this.

    Best regards,
    Luis Fernando Rodríguez S.
  • Hello Luis

    Thanks for the response.

    In the architecture implementation, radio module will act as I2S master and MEMS microphone and codec will function as the slaves on the I2S bus.

    please elaborate how the digital I2S audio data will be routed to the radio module? will it be routed through the codec or directly to the radio module?

    as per my understanding, audio input data from MEMS microphones will be routed to the radio module bypassing the CODEC on the bus. For audio output I2S signals , these will be routed through the CODEC to the speakers.

    Is my understanding correct? please advise.

    regards

    arvind

     

  • Hi, Arvind,

    Could you provide more information about this? Do you have any diagram that could explain the I2S connections of your architecture?

    The AIC3254 I2S bus is able to share data through the DIN/DOUT lines. Additionally, the TDM mode can be used in case of multiple data is shared. If your devices don't support TDM mode, then you would require another codec with multiple data serial interfaces such the TLV320AIC32x2.

    Best regards,
    Luis Fernando Rodríguez S.
  • hello Luis

    please find attached the intended architecture for the application.


    I2S Architecture.doc

    Is the depicted I2S architecture feasible. please advise.

    regards

    arvind

  • Hi, Arvind,

    The TLV320AIC3254 supports TDM mode. So, it can handle this architecture without problems. Basically, the TDM mode adds an offset in the data lines that avoids collision with the sent or received data. You only must ensure that TDM mode is supported by your other I2S devices.

    Best regards,
    Luis Fernando Rodríguez S.
  • Hello Luis

    Thanks for the response.

    To further elaborate the intended architecture:

    1.Digital audio I2S data from MEMS sensors will be routed to radio module, and codec will act as a controller on the I2S bus with serializers disabled.

    2. For digital audio data over radio, it will be routed to the speaker through codec.

    Further , please advise on the below point:

    Digital I2S audio data available on the I2S port of the TLV320AIC3254,can it be routed to individual ADC and DAC ?

    the use case arises, if the digital audio data is to routed to external speaker through codec DAC inspite of radio path ? please advise.

    regards

    arvind

  • Hi, Arvind,

    In this case, the TDM mode is not necessary. The three devices (MEMS mic, radio module and codec) must share the WCLK and BCLK clocks. The digital data output will be routed to the digital data input pin from the MEMS mic to the Radio Module. Then, the digital data output of Radio Module will be routed to the digital data input pin of the codec. In the codec, this I2S data is routed to the DAC directly and then it can be routed to the headphone/line outputs (this codec doesn't support speaker output). This I2S data can also be routed to the ADC with the programmable miniDSP if necessary.

    Please let me know if you have additional questions or comments.

    Best regards,
    Luis Fernando Rodríguez S.