So excited EE Times named our new low-power, 500-MSPS DACs - the 12-bit DAC3162 and 10-bit DAC3152 - "Product of the Week". What an honor! If you don't subscribe to the EE Times Products Newsletter or missed it last week, check it out below. Woo-Hoo! :-)
November 11, 2011
News & Analysis
Education & Training
Welcome to this week's EETimes Products Newsletter! Energy harvesting continues to emerge as a hot new trend in the consumer electronics sector. In fact, IDTechEx research finds that the market for energy harvesting components could reach more than $4 billion in ten years compared to just $79 million in 2009. That includes 250 million sensors powered by an energy harvester (at an average price of $6 per harvester). Applications include numerous consumer electronics devices, including laptops, ebooks and cell phones. The driving force behind the trend is the need to power sensor networks and mobile devices without batteries.A couple of major chip manufacturers recently introduced new parts to aid in the acceleration of this smart-energy trend. For instance, this week STMicroelectronics introduced a 16-kbit memory that can also harvest enough energy to enable small electronic items using it to become battery-free electronic applications. Texas Instruments late last month released a harvesting boost charger that features efficiency, low quiescent current, and superior cold-start capability. The bq25504 boost charger manages the extraction of microwatts and milliwatts from solar, thermal, electromagnetic (RF) , and vibration transducers as sources, and manages the storage of the energy in batteries and supercapacitors. Check them out! Ismini Scouras EE Times Products Editor
Product of the Week
TI claims smallest, lowest power, dual, 500-MSPS DACs
The new DACs aim to reduce the cost of wideband transmit systems.
Product News: Editors' Picks
Advanced technology ADI debuts tactical-grade MEMS A new tactical-grade inertial-measurement unit (IMU) from Analog Devices Inc. achieves performance rivaling expensive, bulky fiber-optic based units by virtue of micro-electro-mechanical system (MEMS) chips that are almost eight-times smaller and over 10-times lighter, according to the company.
Analog In-amp arena gets a new player Microchip Technology enters instrumentation amplifier market with low-power, self-calibrating MCP6N11
Electromechanical Miniature snap-action pushbutton switches offer fast switching, longer electric life Marketed under the brand-name ALCOSWITCH Blue, these miniature switches from TE Connectivity incorporate an innovative snap-action mechanism that ...
Embedded Tools LDRA tool suite integrates MISRA AC for verification of auto-generated code LDRA's MISRA AC provides independent verification of the auto-generated code, a critical factor in stringent certification requirements.
FPGAs/PLDs Latest and greatest Quartus II design software from Altera In addition to supporting Arria V and Cyclone V FPGAs, the latest version of Altera's Quartus II version 11.1 also offers productivity improvements.
IP/EDA Apache comes out with an RTL power flow Power has moved from being a secondary design consideration to a primary one and that requires some new tools and techniques…
Power Small P-Channel MOSFET raises efficiency, offers smaller package Diodes Inc. DMP1245UFCL 12V enhancement mode device targets portable products
Processors ARM announces 8-way graphics core ARM Holdings plc has announced the next core in its Mali line of graphics processing units, which is intended to start appearing in smartphone system-chips in 2013.
RF/Microwave Firm releases first handheld software defined radio Epiq Solutions has announced Matchstiq, which it claims is the world's smallest commercially available software defined radio (SDR) capable of tuning ...
Product How Tos
Hands On: Improve performance in RF transceiver designs This paper describes ZIF and superheterodyne receiver differential interfaces for the demodulator, IF VGA, mixer, and analog port of the ADC, as well ... Building a C++ interface for your embedded DBMS In this Product How-To article, Raima's Jeff Parsons describes the procedures he went through to build a C++ interface for the company's RDM ... Making capacitive touch sensors water tolerant In this Product How-To article, Mark Lee of Cypress uses the company's CY8C21434 PSoC to explain the methods by which to integrate water tolerant ... Get control of ARM system cache coherency with ACE verification In this Product How-Two article, the Cadence authors describe how to use the company's Verification IP solutions framework to implement ARM's AMBA 4 ... Making your application code multicore ready In this product how-to article Vector Fabrics' Paul Stavers describes a more efficient way to parallelize code for embedded multicore designs ...
Technology and Tips for Developing Rich UIs on IPTV and Set Top Box Products
Wireless pen input demonstrated at Mobile World Congress
Multi-party HD video teleconferencing at MWC
TMS570 Microcontroller Development Stick Overview
Getting Started with HALCoGen
TI's New Space Saving Package
Remote desktop applications on the OMAP platform
Great graphics capabilities of TI OMAP 5 platform
TI's Newest Low-voltage Comparator
Experiences optimized on the OMAP platform
Fundamentals of Advanced Real-Time Operating Systems
Fundamentals of Measurement
Fundamentals of Solar: Off-Grid
LTE positioning methods and how to test on terminal receivers
Solutions for Fitting High Performance RF Signal Chains into Small Spaces
HTML5 for automotive infotainment: What, why, and how?
McAfee and Wind River Present: The State of Embedded Security and Steps to Improvement
Effective Development & Certification of DO-178B/C Compliant Software with Integrity, A PTC Product
A Simple, Cost-Effective, Power Line Communication Solution for Building and Power System Monitoring and Control
Hot tips and tricks for the Eclipse IDE
A19 LED bulbs: What's under the frosting?
Wide Bluetooth, Wi-Fi adoption seen in handsets
Tear Down: Handset's touch sensor permits more functions in less space
Inside the Samsung Galaxy Tab: Taking on the iPad
Inside Xbox 360's Kinect controller
Around the Network Events
STMicroelectronics Virtual Conference :: Challenges in High-Performance Embedded Designs
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