TI E2E Community

Tracking down spurious signals in high-speed DACs

Kristina Arnold — Mon, 14 May 2012 18:11:00 GMT

Robert Keller, Systems and Advanced Technology Manager for our High Speed Data Converter business, is a regular contributor to the long-standing and wildly popular Signal Chain Basics article series from EE Times. Robert's newest article, "Tracking down spurious signals in high-speed DACs," is hot off the presses...so to speak. ;-)

If you like that one, be sure to check out his previous article, "Tracking down spurious signals in high-speed ADCs."

Not familiar with the Signal Chain Basics series? It includes more than 60 articles written by TI analog experts spanning a wide variety of signal chain topics. For more articles, visit http://www.eetimes.com/ContentEETimes/Documents/Schweber/SCBlist.pdf.

High-speed data converter roundup: February edition

Kristina Arnold — Mon, 19 Mar 2012 20:45:00 GMT

Continuing the new feature we started last month on Analog Wire, we’ve posted a “Monthly Roundup” with our newest technical articles by TI signal chain experts and some of our more notable news coverage.

We’re especially excited that EE Times China named the ADC12Dxx00RF a Data Converter of the Year. It’s one of only three data converters to make the list, and it’s the only high-speed data converter recognized. That win is highlighted below, along with a few other things I thought you might find of interest. Enjoy!

Technical articles

“Band-Pass Filter Design Techniques for High-Speed ADCs,” February 27, 2012
“Eight ways to improve RF spurious performance,” RF & Microwave DesignLine, February 27, 2012 (this is actually about RF, but I thought y’all might be interested)

Media coverage

“High-speed DAC and ADC family,”Microwave Journal, February 14, 2012
“Texas Instruments to Perform LTE demo of 1.5GHz CMOS DAC for 3G/4G Basestations at Mobile World Congress,”EE Daily News, February 27, 2012
“Mobile World Congress 2012, Day 4: The final day of the 2012 Mobile World Congress found new semiconductors, innovative applications, and creative testing techniques,”Test & Measurement World, March 1, 2012

Awards

EETimes China ACE Awards, Data Converter of the Year category, ADC12Dxx00RF

TI slashes cost of evaluating high-speed data converters by up to 80%

Kristina Arnold — Thu, 23 Feb 2012 17:19:38 GMT

Today we announced the industry’s highest-performance and lowest-cost evaluation boards for evaluating high-speed data converters. The TSW1400EVM data capture and pattern generation board evaluates up to 16-bit ADCs and DACs. It costs 75% less than the previous generation, while providing 2x more memory. Buy it now for US$649.

That’s pretty cool in and of itself, but there’s more. The TSW1405EVM for pattern capture and the TSW1406EVM for pattern generation are the lowest-cost solutions of their kind by up to 80%, providing simple and ultra-low cost platforms for quick evaluation of our data converters. The TSW1405EVM and TSW1406EVM will be available next month for a suggested retail price of US$99 respectively.

Key features and benefits of the TSW1400EVM:

Complete system to capture and evaluate data samples and to generate and send desired test patterns to DAC evaluation modules (EVMs) via an intuitive graphical user interface (GUI).
Includes 1 GB of memory, twice as much as competing platforms, enabling 512-M sample depth for higher fast Fourier transform (FFT) resolution and capturing larger data frames for demodulation analysis.
Compatible with CMOS- and LVDS-interface ADC and DAC EVMs, while supporting up to eight simultaneous-channel analyses.
Supports up to 1.5-GSPS LVDS I/O rates for both ADCs and DACs, enabling use with most TI ADC and DAC EVMs at maximum interface and sample rates.

Key features and benefits of the TSW1405EVM and TSW1406EVM:

Provide simple pattern generation for 16-bit LVDS ADCs and DACs with up to 64k sample depth via an easy-to-use graphical user interface.
Support 1-GSPS LVDS I/O rates for both ADCs and DACs, enabling use with most TI ADC and DAC evaluation modules at maximum sample rates.
Industry’s lowest-cost evaluation platforms with a suggested retail price less than US$100.

Fastest 16-bit DAC @ 1.5 GSPS – Samples, EVMs available now

Kristina Arnold — Thu, 23 Feb 2012 17:03:00 GMT

Today we announced the industry’s fastest 16-bit DAC at 1.5 GSPS. The quad DAC34SH84 is 50% faster and uses 50% less power than the closest 16-bit DAC alternative, clocking in at 1.5 GSPS and consuming just 362 mW per channel. It provides an easy, pin-compatible upgrade from the 1.25-GSPS DAC34H84 for customers wanting to maximize speed in 3G, LTE, GSM and WiMAX wireless base stations and repeaters; microwave point-to-point radio; software defined radio; and waveform generation systems.

The DAC34SH84 is sampling now in a small 12-mm x 12-mm BGA package. Production quantities are expected in 2Q 2012 for a suggested retail price of US$78 in 1,000-unit quantities.

Key features and benefits:

Increased bandwidth: 750-MSPS-per-DAC input rate supports up to 600-MHz complex bandwidth for fifth order linearization of 120 MHz – three times wider than the competition when running at maximum sample rates.
Frequency agility: 2x to 16x interpolation and two independent, 32-bit numerically controlled oscillators lower the interface rate and cost of FPGAs while providing flexibility in frequency planning.
RF sideband image suppression: On-chip calibration of complete RF transmit path suppresses sideband and local oscillator feed-through while driving IQ modulators, such as the new TRF3705.
Fastest 16-bit DACs available: The DAC34SH84 joins the DAC3484 family, which includes the industry’s next-fastest 16-bit DACs: the quad, 1.25-GSPS DAC3484 and DAC34H84, and the dual, 1.25-GSPS DAC3482. In addition to speed, the family helps designers maximize the power efficiency of their designs.

Tools for the DAC34SH84:

DAC34SH84EVM, which includes transformer-coupled IF outputs to evaluate the DAC34SH84 directly. Buy now for US$499.
TSW30SH84EVM for complete bits-to-RF transmitter prototyping. It includes the DAC34SH84 in addition to the TRF3705 IQ modulator; LMK04800 ultra-low jitter clock cleaner; TI power management devices, such as DC/DC converters and low-noise LDOs; and a power amplifier. Buy now for US$499.
TSW1400EVM pattern generation module for sourcing patterns at high speeds into the DAC34SH84EVM. It features a high-speed, double-data rate LVDS output bus that provides 16 bits of data at 1.5 GSPS per bit. When combined with the DAC34SH84EVM or TSW30SH84EVM, the TSW1400EVM enables modulated pattern generation with a large on-board memory while offering a flexible evaluation environment. Buy now for US$649.
TSW1406EVM pattern generation module provides a lower-cost alternative for simple pattern generation up to 1 GSPS per bit. It’ll be available in March for a suggested retail price of US$99.

High-speed data converter roundup: January edition

Kristina Arnold — Tue, 14 Feb 2012 15:35:01 GMT

We just added a regular feature called the “Monthly Roundup” to Analog Wire, our E2E blog devoted to all things signal chain. The roundup is a compilation of new technical articles by TI signal chain experts, some of our more notable news coverage, and other goodies we collect along the way. Here’s a snapshot of what made noise on the data converter front in January.

Technical articles

"High speed, analog-to-digital converter basics," January 11, 2012
"Understand the tradeoffs of increasing resolution by averaging," Electronic Design, January 11, 2012

Here a couple more you might also find of interest*...

"Low supply TRF3765 performance evaluation," January 4, 2012
"TRF3765 REF_IN impedance," January 11, 2012

*The TRF3765 is PLL/VCO that can be used with TRF3703/3704/3705 IQ modulators and TI high-speed DACs in a transmit chain.

Media coverage

"TI's integration strategy for National Semiconductor devices begins to take shape," EE Times Europe, January 2, 2012
"TI unveils analog front-end for femtocells and portable software-defined radio," Microwave Journal, January 19, 2012 (Includes video demo)
"Use a switching regulator to power a high-speed ADC," EDN, January 19, 2012
"AFE chips target femtocells, picocell basestations, and other SDRs," Mobile Dev & Design, January 20, 2012

White paper now available: Designing a spreadspectrum radio transceiver

Kristina Arnold — Tue, 07 Feb 2012 22:30:00 GMT

TI partner Critical Link, an embedded systems development firm, had a customer that needed to design a spreadspectrum radio transceiver. The problem? The customer developed algorithms to modulate and demodulate the signals, but they didn’t have the resources or expertise to design the complete software-defined radio (SDR)-based system.

Critical Link used its MityDSP-L138F system-on-module as the basis for the SDR because it provides the processing-horsepower needed and would save the customer significant up-front design cost. The MityDSP-L138F module features a TI OMAP-L138 DSP+ARM® Processor and Xilinx Spartan®-6 LX16 FPGA, along with NAND and NOR flash, and DDR2 memory.

Additionally, TI evaluation modules were used to prototype the system’s high-speed analog-to-digital converter (ADC) and digital-to-analog converter (DAC): the 16-bit, 80 MSps ADS5562 ADC and 14-Bit, 125 MSPS THS5671 DAC. These data converters were selected for their high dynamic-range performance while sampling at the required 60 MSPS, offering a highly flexible receiver and transmitter for the Mighty-DSP radio kit.

Learn more about how Critical Link and TI partnered to develop a complete solution to meet this customer’s software defined radio (SDR) needs here: www.ti.com/sdr-upp-wp-pr.

Highest-performance analog front end for femtocells and portable software-defined radio

Kristina Arnold — Tue, 24 Jan 2012 23:51:00 GMT

If you’re designing femtocell base stations or portable software-defined radio applications, we a couple of new AFEs right up your alley!

The AFE7225 is the industry’s fastest, highest-performance analog front end for femotcell base stations and portable software-defined radio applications. It integrates a dual 125-MSPS analog-to-digital converter (ADC) and dual 250-MSPS digital-to-analog converter (DAC). It operates 25% faster than the competition, while increasing the SNR by 2 dB and providing up to 5x the DAC output current.

If you’re designing an application that’s lower bandwidth and more power sensitive, we also have the new 12-bit AFE7222. It integrates a dual 65-MSPS ADC and dual 130-MSPS DAC and uses only 398 mW in full-duplex or 212 mW in half-duplex receive mode at full speed.

The AFE7225 and AFE7222 both integrate more digital signal processing capabilities than similar AFEs, which increases design flexibility. They are the only mixed-signal AFEs with independent transmit and receive, 32-bit NCOs, serialized LVDS input/output options, and independent transmit/receive quadrature modulation correction for gain, phase and offset imbalances.

Both AFEs can be used in heterodyne or direct-conversion radio architectures. For heterodyne radios, a single DAC channel in the AFEs can be used to create an intermediate frequency up to approximately 100 MHz for transmit, and a single ADC channel can be used to capture IFs of more than 300 MHz, with the unused channels shut down to conserve power. For femtocell base stations, the AFEs provide macro-cell performance when combined with high-quality RF components, such as the TRF372017 IQ modulator with local oscillator and the TRF371125 IQ demodulator.

Key features and benefits of the AFEs include the following:

Low power consumption. Consume only 12 mW of power in deep-sleep mode with a wake-up of only 13 us, or as little as 120 mW in light-sleep mode with 5-us wake-up time.
High performance for clearer signals. Dual ADC achieves 70 dB SNR, while the dual DAC achieves an adjacent channel leakage ratio of 75 dB with a 3G W-CDMA cellular signal.
Signal processing reduces FPGA gate count requirements, interface speed and cost. Both feature independent transmit and receive digital block up- and down-conversion with 2x to 4x interpolation, 2x decimation, coarse and 32-bit NCO frequency mixers; digital correction of gain, phase and offset for quadrature modulation receive and/or transmit; and a peak/rms power meter.
Integration reduces system cost. Dual 12-bit auxiliary DAC and dual-input 12-bit auxiliary ADC eliminate the need for a separate monitoring and control device, reducing board space, power and cost.
Flexibility for designers. Digital DAC inputs and ADC outputs can be configured for serial LVDS to save pin/trace-count and aid long-trace signaling; or multiplexed 12-bit CMOS for a low-power interface, supporting full-duplex over two buses or half-duplex from one or two digital buses.

Evaluation modules are available now for $499. The AFE7222EVM and AFE7225EVM include the TRF370333 IQ modulator and CDCE72010 clock jitter cleaner, as well as TI power management devices, such as DC/DC converters and low-noise LDOs, to provide a complete bits-to-RF prototyping and reference design.

An IBIS model to verify board signal integrity requirements is also available.

The AFE7225 is available in a 9-mm x 9-mm QFN package for a suggested retail price of $29.50 for 1,000-units. The AFE7222 is available in a 9-mm x 9-mm QFN package for a suggested retail price of $19.50 in 1,000-unit quantities.

EE Times names DAC3162/DAC3152 "Product of the Week"

Kristina Arnold — Mon, 14 Nov 2011 18:58:00 GMT

So excited EE Times named our new low-power, 500-MSPS DACs - the 12-bit DAC3162 and 10-bit DAC3152 - "Product of the Week". What an honor! If you don't subscribe to the EE Times Products Newsletter or missed it last week, check it out below. Woo-Hoo! :-)

November 11, 2011

Home	News & Analysis	Business	EE Life	Embedded.com	Design	Products	Education & Training	Events	Video

Editor's Note

Welcome to this week's EETimes Products Newsletter!

Energy harvesting continues to emerge as a hot new trend in the consumer electronics sector. In fact, IDTechEx research finds that the market for energy harvesting components could reach more than $4 billion in ten years compared to just $79 million in 2009. That includes 250 million sensors powered by an energy harvester (at an average price of $6 per harvester). Applications include numerous consumer electronics devices, including laptops, ebooks and cell phones. The driving force behind the trend is the need to power sensor networks and mobile devices without batteries.

A couple of major chip manufacturers recently introduced new parts to aid in the acceleration of this smart-energy trend. For instance, this week STMicroelectronics introduced a 16-kbit memory that can also harvest enough energy to enable small electronic items using it to become battery-free electronic applications.

Texas Instruments late last month released a harvesting boost charger that features efficiency, low quiescent current, and superior cold-start capability. The bq25504 boost charger manages the extraction of microwatts and milliwatts from solar, thermal, electromagnetic (RF) , and vibration transducers as sources, and manages the storage of the energy in batteries and supercapacitors.

Check them out!

Ismini Scouras
EE Times Products Editor

Product of the Week

TI claims smallest, lowest power, dual, 500-MSPS DACs

The new DACs aim to reduce the cost of wideband transmit systems.

Product News: Editors' Picks

Advanced technology
ADI debuts tactical-grade MEMS
A new tactical-grade inertial-measurement unit (IMU) from Analog Devices Inc. achieves performance rivaling expensive, bulky fiber-optic based units by virtue of micro-electro-mechanical system (MEMS) chips that are almost eight-times smaller and over 10-times lighter, according to the company.

Analog
In-amp arena gets a new player
Microchip Technology enters instrumentation amplifier market with low-power, self-calibrating MCP6N11

Electromechanical
Miniature snap-action pushbutton switches offer fast switching, longer electric life
Marketed under the brand-name ALCOSWITCH Blue, these miniature switches from TE Connectivity incorporate an innovative snap-action mechanism that ...

Embedded Tools
LDRA tool suite integrates MISRA AC for verification of auto-generated code
LDRA's MISRA AC provides independent verification of the auto-generated code, a critical factor in stringent certification requirements.

FPGAs/PLDs
Latest and greatest Quartus II design software from Altera
In addition to supporting Arria V and Cyclone V FPGAs, the latest version of Altera's Quartus II version 11.1 also offers productivity improvements.

IP/EDA
Apache comes out with an RTL power flow
Power has moved from being a secondary design consideration to a primary one and that requires some new tools and techniques…

Power
Small P-Channel MOSFET raises efficiency, offers smaller package
Diodes Inc. DMP1245UFCL 12V enhancement mode device targets portable products

Processors
ARM announces 8-way graphics core
ARM Holdings plc has announced the next core in its Mali line of graphics processing units, which is intended to start appearing in smartphone system-chips in 2013.

RF/Microwave
Firm releases first handheld software defined radio
Epiq Solutions has announced Matchstiq, which it claims is the world's smallest commercially available software defined radio (SDR) capable of tuning ...

Product How Tos

Hands On: Improve performance in RF transceiver designs
This paper describes ZIF and superheterodyne receiver differential interfaces for the demodulator, IF VGA, mixer, and analog port of the ADC, as well ...

Building a C++ interface for your embedded DBMS
In this Product How-To article, Raima's Jeff Parsons describes the procedures he went through to build a C++ interface for the company's RDM ...

Making capacitive touch sensors water tolerant
In this Product How-To article, Mark Lee of Cypress uses the company's CY8C21434 PSoC to explain the methods by which to integrate water tolerant ...

Get control of ARM system cache coherency with ACE verification
In this Product How-Two article, the Cadence authors describe how to use the company's Verification IP solutions framework to implement ARM's AMBA 4 ...

Making your application code multicore ready
In this product how-to article Vector Fabrics' Paul Stavers describes a more efficient way to parallelize code for embedded multicore designs ...

Additional Resources

Courses

Technology and Tips for Developing Rich UIs on IPTV and Set Top Box Products

Wireless pen input demonstrated at Mobile World Congress

Multi-party HD video teleconferencing at MWC

TMS570 Microcontroller Development Stick Overview

Getting Started with HALCoGen

TI's New Space Saving Package

Remote desktop applications on the OMAP platform

Great graphics capabilities of TI OMAP 5 platform

TI's Newest Low-voltage Comparator

Experiences optimized on the OMAP platform

Fundamentals

Fundamentals of Advanced Real-Time Operating Systems

Fundamentals of Measurement

Fundamentals of Solar: Off-Grid

Webinars

LTE positioning methods and how to test on terminal receivers

Solutions for Fitting High Performance RF Signal Chains into Small Spaces

HTML5 for automotive infotainment: What, why, and how?

McAfee and Wind River Present: The State of Embedded Security and Steps to Improvement

Effective Development & Certification of DO-178B/C Compliant Software with Integrity, A PTC Product

A Simple, Cost-Effective, Power Line Communication Solution for Building and Power System Monitoring and Control

Hot tips and tricks for the Eclipse IDE

Teardowns

A19 LED bulbs: What's under the frosting?

Wide Bluetooth, Wi-Fi adoption seen in handsets

Tear Down: Handset's touch sensor permits more functions in less space

Inside the Samsung Galaxy Tab: Taking on the iPad

Inside Xbox 360's Kinect controller


	Around the Network Events STMicroelectronics Virtual Conference :: Challenges in High-Performance Embedded Designs



To subscribe to this Newsletter or change your email preferences please click here Go to EETimes.com A UBM Electronics Newsletter © 2011. All rights reserved Privacy Policy I Advertising Information I Unsubscribe This email was sent to: lbabbili@golinharris.com UBM Electronics, 303 Second Street, Suite 900 South, San Francisco, CA 94107

Smallest, least-expensive, lowest-power 500-MSPS DACs

Kristina Arnold — Thu, 10 Nov 2011 19:17:00 GMT

In case you missed it, we recently announced the smallest, least-expensive and lowest-power dual 500-MSPS DACs. The 12-bit DAC3162 and 10-bit DAC3152 were designed for wideband transmit systems like base stations, software defined radio and portable test equipment. To dive a little deeper, check out the news release below.

Think they might be a fit for a project you're working on? Samples and EVMs are available now, and production quantities are expected later this month.

We’re pretty excited about these DACs, and it looks like our friends at EE Times are as well. Janine Love’s write up has been promoted in the EE Times daily email three times this week. Yay! :-) As always, feel free to let us know what you think by commenting below. We'd love to hear from you!

TI offers industry’s smallest, lowest power dual, 500-MSPS DACs, reduces the cost of wideband transmit systems

DALLAS (Nov. 2, 2011) – Texas Instruments Incorporated (TI) (NYSE: TXN) is reducing the bill of materials for wideband transmit systems with new dual, 500-MSPS digital-to-analog converters (DACs) starting at less than $10 in 1,000 unit quantities. The 12-bit DAC3162 and 10-bit DAC3152 are the smallest, least-expensive and lowest-power devices in their class and were designed for wideband transmit systems, such as wireless base stations, software defined radio, point-to-point microwave, e-band radio and portable test equipment. For more information and to order samples of these new data converters, visit www.ti.com/dac3162-pr.

Key features and benefits:

Lowest power consumption by at least 30 percent extends the battery life of portable devices. At 500 MSPS, the DAC3162 uses only 135 mW per channel with 20 mA output current and 67 mW per channel with 2-mA output current.
Small 7-mm x 7-mm QFN package cuts board space requirements by 50 percent compared to the next smallest dual, 500-MSPS DAC solution.

Pin-for-pin compatibility makes it easy to achieve 12- or 10-bit resolution and cost flexibility without board or software changes.

Simplified interface eliminates the need for the serial peripheral interface (SPI).

Tools, availability and pricing

Samples of the DAC3162 and DAC3152 are available today in a 48-pin, 7-mm x 7-mm QFN package. Production quantities are expected in November 2011. 1,000-unit pricing will start at $12.60 for the DAC3162 and $9.15 for the DAC3152.

TI also offers evaluation modules (EVMs) for the DAC3162 and DAC3152, complete with a transceiver chain that includes the CDCP1803 clock buffer and TRF370333 quadrature modulator. These new EVMs are fully compatible with TI's TSW3100 pattern generator module for rapid evaluation. The DAC3162EVM and DAC3152EVM are available now, priced at $199.

An IBIS model is also available.

Lowest power dual 14-bit 250MSPS ADS4249 ADC - now in production!

Philip Pratt — Mon, 17 Oct 2011 19:25:58 GMT

Checkout the world's lowest power dual 14-bit 250MSPS ADC, the ADS4249. Its now in full production.

http://www.ti.com/product/ads4249

This is TI's 2nd generation, following the ADS62P49 with 60% lower power at 560mW, SNR >72dBFS and SFDR>80dBc. It has a similar pinout to the ADS62P49, but uses all 1.8V supplies. Migration information from the ADS62P49 to the ADS4249 is in the datasheet.

Industry's lowest power 2- and 4-channel 1.25GSPS Digital-to-Analog Converters: DAC3484, DAC3482, DAC34H84 now in production!

Philip Pratt — Tue, 02 Aug 2011 20:17:00 GMT

These are now available for orders!

Part Numbers and Product Descriptions –

DAC3484, 4-channel 16-bit 1.25GSPS DAC with 312.5MSPS/DAC input rate, multi-row QFN package

DAC3482, 2-channel 16-bit 1.25GSPS DAC with 625MSPS/DAC input rate, multi-row QFN package

DAC34H84, 4-channel 16-bit 1.25GSPS DAC with 625MSPS/DAC input rate, BGA package

65% lower power, 25% faster, and 40% smaller than competitor quad 1G DAC

Key features and benefits

16-bit interleaved 1.25 GSPS input halves the I/O count, reducing FPGA costs and simplifying board routing
9x9-mm multi-row QFN package enables higher density main/diversity transmitters
Low jitter 2x-32x phase locked loop eliminates the need for an external, low jitter clock multiplier to match the interpolated rate.
2x-16x interpolation and two independent 32-bit NCOs (Numerically Controlled Oscillators) lowers the interface rate and cost of FPGAs, while providing flexibility in frequency planning
Offset, gain, group delay and phase control for system calibration significantly improves sideband suppression for wideband signals when interfacing with IQ modulators, such as the TRF372017, in direct up-conversion radios.

Target Markets

Basestation Receivers: 3G/4G base stations, wideband repeaters, software defined radios, radar

See www.ti.com/dac3484 for more information

Get Your Signal Chain Basics: “Digital features in high-speed digital-to-analog converters”

Kristina Arnold — Mon, 25 Jul 2011 19:45:00 GMT

Robert Keller, who oversees our illustrious high-speed data converters systems and apps team, is a regular contributor to the “Signal Chain Basics” series on EE Times. In his newest article, “Digital features in high-speed digital-to-analog converters,” Robert explains how the digital features in one of our newest high-speed DACs – the DAC34H84, a 4-channel, 16-bit, 1250 Msps DAC – eases system implementation by reducing data rates and improving output signal characteristics.

Check out what he has to say!

Wowza!! Eight new low-power, dual-channel, 12- and 14-bit ADCs from 65 to 250 MSPS

Kristina Arnold — Thu, 21 Jul 2011 14:11:00 GMT

Today we announced eight new high-speed, ultra-low power consumption ADCs. These dual-channel devices are available in 12- and 14-bit resolutions at speeds from 65 to 250 MSPS. EVMs and samples are available for most of the devices today! Here’s the press release with links to more information…

TI bolsters ultra-low-power, high-speed, ADC family with eight dual-channel devices from 65 to 250 MSPS

DALLAS (July 21, 2011) – Texas Instruments Incorporated (TI) (NYSE: TXN) today expanded its line of high-speed, ultra-low power consumption analog-to-digital converters (ADCs) with eight dual-channel devices available in 12- and 14-bit resolutions at speeds from 65 to 250 MSPS. With these additions, the ADS42xx family provides the performance and bandwidth needed for 3G/LTE wireless base stations, portable test and measurement and software defined radio applications, while providing best-in-class power consumption. For more information and to order samples, visit www.ti.com/ads42xx-pr.

Key features and benefits of the ADS42xx family

The 14-bit ADS4246 uses 332 mW total power at 160 MSPS, 35-percent less power than its closest competitor. The family provides options down to 92 mW per channel to reduce board heating and operating costs.
Pin-compatible 12- and 14-bit options, with speeds ranging from 65 to 250 MSPS, enable customers to move to higher resolutions and sample rates without redesigning the board.
Pin-compatible with 11-bit, 200-MSPS ADS58C28, providing a license-free export option with up to 65 MHz of high-performance RF channel bandwidth at input frequencies over 200 MHz.
6-dB programmable gain option provides the flexibility needed to achieve a high signal-to-noise ratio of up to 73.6 decibel full scale (dBFS) and spurious free dynamic range (SFDR) of up to 91 dBc for high receive sensitivity in 3G/LTE wireless infrastructure.

Tools and support

TI offers a variety of tools and support to speed development with the ADS42xx family, including:

An evaluation module (EVM) for each part.
TSW1200 digital capture tool for rapid analysis of EVMs.
An Altera-compatible high-speed mezzanine connector and Xilinx-compatible FPGA mezzanine connector, allowing ADS42xx EVMs to mate to FPGA EVMs to speed system-level prototyping.
IBIS models to verify board signal integrity requirements.
Software for calculation utilities, including an ADC harmonic calculator, anti-aliasing calculation tool, and jitter and SNR calculator.

Availability and packaging

The ADS42xx family is offered in a 64-pin QFN package. 1,000-unit pricing and availability for the new devices follow below.

65 MSPS

14-bit ADS4242 is available today for a suggested retail price of $28.00.
12-bit ADS4222 will be available in August for a suggested retail price of $18.00.

125 MSPS

14-bit ADS4245 is available today for a suggested retail price of $51.25.
12-bit ADS4225 will be available in August for a suggested retail price of $31.30.

160 MSPS

14-bit ADS4246 is available today for a suggested retail price of $73.50.
12-bit ADS4226 is available today for a suggested retail price of $39.00.

250 MSPS

14-bit ADS4249 will be available 3Q 2011 for a suggested retail price of $133.50.
12-bit ADS4229 is available today for a suggested retail price of $67.50.

Keeping in touch...

Kristina Arnold — Tue, 19 Jul 2011 15:08:00 GMT

Welcome to the new High Speed Data Converters Announcements tab! We'll be using this area to post the latest and greatest in TI High Speed Data Converter products, along with other information we think you'll love.

We'll post a ton of great stuff here, including, but not limited to:

New tools and resources - From product selection and evaluation to design, our powerful portfolio of tools and resources is here to help. We'll keep you in the loop on our latest releases.
Technical information - We'll post new videos, articles and blog posts from our high speed data converter experts. They're scary smart, and they're here to help.
New Products - Our design team's got some really cool high speed data converters in the works. We'll keep you posted as they become available.

And the best news is, you don't have to bookmark this page or remember to check it. Simply click "Email subscribe to this blog" on the left hand navigation bar, and we'll send you a message whenever we post new content.