I understand that the value of thermal resistance (theta JA and JC) in datasheet is applied under no air flow condition.
Is my understanding correct ?
And is this understanding common for all high speed ADC from SVA ?
The thermal resistance Theta-JA is based on natural convection (no forced airflow).
The thermal resistance Theta-JC1 (die to top of case) is based on the top of the package being connected to a fixed temperature sink, and assuming all heat is dissipated through that conductive path.
The thermal resistance Theta-JC2 (die to center balls on bottom of package) is based on the center ground balls of the package being connected to a fixed temperature sink, and assuming all heat is dissipated through that conductive path.
This is common for all ADC10D1X00 and ADC12Dxxx GSPS ADC devices in this Thermally Enhanced BGA package.
Thank you for your quick response.
I understand the way of thinking for thermal resistance well.
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