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Thermal resistance of ADC12D500RF

Thermal resistance of ADC12D500RF

This question is answered
S.Satoshi
Posted by S.Satoshi
on Apr 10 2012 23:04 PM
Genius3215 points

I understand that the value of thermal resistance (theta JA and JC) in datasheet is applied under no air flow condition.

Is my understanding correct ?

And is this understanding common for all high speed ADC from SVA ?

Best Regards,

ADC12D500RF High-speed data converter
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  • Jim Brinkhurst84999
    Posted by Jim Brinkhurst84999
    on Apr 11 2012 11:25 AM
    Verified Answer
    Verified by Jim Brinkhurst84999
    Expert4590 points

    The thermal resistance Theta-JA is based on natural convection (no forced airflow).

    The thermal resistance Theta-JC1 (die to top of case) is based on the top of the package being connected to a fixed temperature sink, and assuming all heat is dissipated through that conductive path.

    The thermal resistance Theta-JC2 (die to center balls on bottom of package) is based on the center ground balls of the package being connected to a fixed temperature sink, and assuming all heat is dissipated through that conductive path.

    This is common for all ADC10D1X00 and ADC12Dxxx GSPS ADC devices in this Thermally Enhanced BGA package.

    Best regards,

    Jim B

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  • S.Satoshi
    Posted by S.Satoshi
    on Apr 11 2012 20:47 PM
    Genius3215 points

    Hi Jim-san,

    Thank you for your quick response.

    I understand the way of thinking for thermal resistance well.

    Best Regards,

    S.Satoshi

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