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ADS5407 PCB structure Build-up PCB

Jin Kyung Han
Expert 1520 points
Other Parts Discussed in Thread: ADS5407

Hello

My customer is considering to use ADS5407.

One thing she is facing with high cost to design it becuase of considering Build-PCB structure. The cost of Build-up is more expensive than non Build-up.

According to the ADS54xEVM, the strucure of PCB may be a Build-up type.

1. Therefore, I want to know whether the PCB should be designed as Build-up type or Not?

2. If no need for Build-up, Why TI use Build-up structure for ADS5407 EVM PCB? 

3. Do you have recommendation how to avoide Build-up strucuture ; Low cost PCB design guide?

Thanks and Best Regards

  • 0
    TI__Mastermind 29220 points

    Hi,

    I don't know quite what you mean by 'build-up'. 

    Are you trying to make just a 2-layer (double-sided) circuit board for your design?  If so - keep in mind that most of the signal pairs are differential and would expect a good impedance-controlled 100 ohm differential signal pair.  I doubt that could be accomplished with so many differential pairs coming out of a BGA footprint.  And then there is the matter of getting the heat out from a device like this ang ground planes spread out the heat from the many thermal ground balls in the center of the BGA.   If you have something else in mind than what I think you mean, please clarify.

    Regards,

    Richard P.

  • 0 in reply to Richard Prentice
    Expert 1520 points

    Hello

    The PCB layer is not 2-layer but 16 Layer. Ouir customer understand Impedance matching Vs routing differential signals for handling High speed signals like RF.

    Actually we clear the problem PCB design strucure through EVM Gerber files.

    Thanks and Best Regards