Hi engineers
can you help me about the DAC5662 Thermal Resistance(Junction to Ambient/Board/Case)?
Thank you very much.
TIS: johnsin tao.
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Hi engineers
can you help me about the DAC5662 Thermal Resistance(Junction to Ambient/Board/Case)?
Thank you very much.
TIS: johnsin tao.
Hi Johnsin,
We will have to submit a request to thermal design team and it will take 3-4 weeks to get the info from them. I will submit request and will provide you info when it is available.
Regards,
Neeraj Gill
Hi Johnsin,
Here are the thermal resistance parameters.
Thermal Metric |
DAC5662 |
Unit |
RΘJA Junction-to-ambient thermal resistance |
64.4 |
ºC/W |
RΘJC(top) Junction-to-case (top) thermal resistance |
16.7 |
ºC/W |
RΘJB Junction-to-board thermal resistance |
27.7 |
ºC/W |
ΨJT Junction-to-top characterization parameter |
0.4 |
ºC/W |
ΨJB Junction-to-board characterization parameter |
27.5 |
ºC/W |
RΘJC(bottom) Junction-to-case(bottom) thermal resistance |
n/a |
ºC/W |
Regards,
Neeraj Gill