Other Parts Discussed in Thread: LMK04828,
Could you please provide any thermal solder fatigue (thermal cycling) data you may have for your DAC38J84 and LMK04828 products. In particular it would be very useful to know the thermal cycle profile, number of cycles performed, number of units tested, failure rate or Weibull parameters. It would also be very useful to know the solder type and PCB material used for the thermal cycling tests as this will allow us to correlate the data to our use case.