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ADS1178/1278 Thermal Pad should be tied to AGND or DGND ?

Other Parts Discussed in Thread: ADS1178

Hi,


Does anybody knows to which ground plane (AGND/DGND) the thermal pad of ADS1178/1278 should be tied when using separates planes ?

In the datasheet (p28/29) it is only mentioned to connect it to GND and the Application Report SLMA002 redirect us on the component datasheet.

Many thanks
Regards

Tim

  • Hi Tim,

    The connection between AGND and DGND should be made as close to the part as possible, preferably directly underneath the IC. The thermal pad is meant to be tied to the lowest potential on the IC, and since AGND and DGND are meant to be the same potential, it really should not matter whether the thermal pad is connected to AGND or DGND.

    On our EVM, we have tied the thermal pad to AGND, so I would suggest doing the same on your board. More importantly, make the connection between AGND and DGND as close to the device as possible using a single plane.

    Best Regards,