Hello,
I would like to ask you for the symbol and footprint of bq51013. I couldn't find them on the product folder, nor on the libraries I've downloaded form TI. I'm using Altium Designer Summer, just in case it helps.
Thank you very much in advance.
Benjamin
Benjamin,
Thank you very much for the inquiry. I am a modeling engineer in Analog eLab.
What is the desired delivery date for the symbol & footprint?
Also, is there a Texas Instruments sales rep, TSR or field applications engineer that supports you?This is not a crtical item ; if you have a TI support person we would simply like to alert them to your inquiry so they can provide follow-up support.
Also, can you let us know the name of your company and the end application for the device?This is not a critical item either. We simply like to know who we are supporting and the end application for our devices.
Thanks & Regards,
John
Hallo John, Right now we're starting to develop our own WPC Qi compliant devices at IMST, and we still have not been assigned any TI representative.
We'd like the symbol and footprint delivered as soon as you can, but if that's not possible we'll try to deal with it.
Thanks for your time John, and best regards, Benjamin
Thank you fo the reply.
The symbol and footprint has been moved up in the queue because of your request.
I am working on an estimated delivery date and hope to have it later today.
This is just a quick follow-up to my earlier note.
The symbol & footprint for the bq51013 will be delivered by next Friday (Oct. 21), hopefully earlier.
This is part of a huge project, the goal of which is to provide our customers with symbols & footprints for all TI products.Ultimately, each symbol and each footprint will be in formats to support their use in six different tools.
Your request moved the symbol & footprint for the bq51013 to the front of the queue.
Your requested symbol and footprint can be provided as an attachment to this forum thread. If you have another preference, please let me know.
Regards,
Those are great news for all TI customers, John.
Thanks for your time. I guess that attaching the symbol & footprint to this thread is the best choice. Shall I have any problem finding it (here or in the product folder) I will contact you again.
Best regards,
Any update on the footprint (recommended layout pad size, via size, drill size) for the BQ51013?
I made a separate post for information related to producing a PCB with this part in the YFF package.
1) pad size?
2) via size and drill size?
3) how much gap between solder mask and pad / via?
4) what temperature is used to melt the balls
5) what kind of surface finish on the PCB is compatible witht he ROHS (non-lead balls)
Thanks,
Thom
I have not been able to find the model/footprint for the bq51013. As Thom did, I just drawed the footprint with the information from the YFF package but the questions he asked must be known to proceed to the manufacturing stage.
Any tips on that?
Apologies for the delay in delivering the requested symbols & footprints.
They are complete and wil be posted in the device product folder on ti.com in the next 24 hours.
The URL is http://www.ti.com/product/bq51013
Please let me know if you have any questions.
Great then,
thanks for the information John.
Also: would it be possible obtaining some recommended values for the questions Thom posted earlier? And the last one: any news on an approximate release date for the bq51013 QFN package?
To be honest the product teams are the best source of information for the remaining questions.
The PCB-related questions can best be answered by your PCB shop. The answers might vary, dependeing on who fabricates your PCBs.
I checked some discussions in the Wireless Power E2E forum and it looks like related questions are being answered there.
Please see Thom's inquiry, and the subsequent answers at:http://e2e.ti.com/support/power_management/wireless_power/f/693/t/142205.aspxIt looks like the reply doesn't answer everything, so your PCB shop is probably the best source for the rest of the information.
For the release date for the QFN package, please track the discussions at:http://e2e.ti.com/support/power_management/wireless_power/f/693/t/142321.aspxandhttps://e2e.ti.com/support/power_management/wireless_power/int_wireless_power/f/698/t/137962.aspx
Allright John,
thank you so much for your help!
Best regards