Hi TI,
My name is Ned Dempsher and I'm a signal integrity engineer here at L-3 Communications.
We have an existing product that uses your SN74LVC2G17DCK and understand that a die shrink has occurred.
I am being asked to make sure that our design will be able to accommodate a drop-in replacement of this newer die but the IBIS model I have is for the older die.
Could you generate an IBIS model for the newer die shrink from your SPICE models so that I can do the necessary simulations to validate the new die?
Thanks Very Much TI!
Ned