I have a 24-to-55V 4.5A design with LM5022 controller. There is a problem as the design requires using two FETs and apparently the thermal simulator does not like this. As far as I can tell the mosfet is "floating" and heats up to a comfy 1156 degrees celcius. I can move one of the two FETs in the thermal simulator configuration but cannot interact with the other. By default both are on top of each other in a copper cut-out.
Any way TI guys could take a look at that? Also it'd be double plus good if some power mosfets I asked for earlier would be implemented. There are still only two available for this kind of spec..