Dear Sir,
I am using Webench designer with the LM25010 switcher IC. It seems perfect but I can not simulate it wih the WSON package, only with the TSSOP.
When I look in the datasheet these package seem to have the same thermal dissipation (junction to ambient) but it sounds strange to me since the WSON is very small.
Am I wrong? can I really replace the TSSOP with the WSON in the design without any changes? It would be awesome!
Many Thanks
Thank you for using Webench Power Designer. The reason why you are unable to simulate with the WSON package is because it's pin mapping is slightly different from HTSSOP. Despite WSON which is a 10-PIN Package, HTSSOP has 14 PINs (EN for heat dissipation improvement).
Please refer to the attached file to rearrange the PIN connection (You can also find this in the LM25010 datasheet, page. 2)
Please let me know if this helps,
Again, thanks for using WEBENCH!
Regards,
--Hadi
