Dear Designers, TI Support.
1) I'm using the TI WEBENCH to design a step-up power supply with the TPS43060. I want to change a device from the proposed ones in the BOM generated by the WEBENCH. I can, of course, change 1 device at time, but if a change a second device, the first one (the one I previously changed) is automatically updated and changed by the BEBENCH. How can I stop the automatically update of the BOM by the WEBENCH to freeze it and change any device I want ?
2) WEBENCH proposes a PCB with copper area predefined to dissipate the heat in the thermal design. If I tray to cancel all copper area in 1 intermediate layer, automatically all the copper areas in the other layers are cancel. How can I avoid it ?
3) Is it possible to import the Gerber file of my PCB for the thermal simulation ?
4) I want to use the WEBENCH to design a step-down converted based on TPS92640 device, but I don't see it in the device list. Is it possible to design a converter using the TPS92640 ? How ?
Thanks and Regards,
Paolo