Hello,
Regarding the TI support and the datasheet, it seems we can not reflow solder the DLP3010, but we have to clamp the DLP3010 with an interposer; it's really the only way to connect the DLP3010? if yes, can you provide help or advice about integration process, because it seems the interposer should be press with a specific compression force.
Best Regards,
Bastien