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Part Number: DLP5500
I am looking for an explanation of the “hermetic sealing process” used for the DLP5500.
The military standards precludes using organic adhesives to hermetically seal a Microcircuit package.
Obviously , this is not a military device but is the adhesive an organic or is a special coating like Atomic
LaYer deposition (ALD) used to obtain true hermeticity. Is the term adhesive to mean something else?
Check the mechanical drawing and there is a note on adhesive.
I am looking at a space application so this requirement is important
Also is there a moisture getter in the package?
KINGS PARK , NY
Industrial Business Development Manager
DLP® Enterprise & Cinema Display
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In reply to Carey Ritchey:
Hi Carey, I able to log in to the TI Forum now and pose this follow up question.
Hi Carey, Thanks for your quick response. For some strange reason I can not reply to you via the TI forum. You are correct on the hermetic requirement on the DLP5500 as I reviewed the data sheet again. My mistake. What DLP devices are hermetic? And a few final questions on the non hermetic DLP products is their any Moisture barrier on the die? And how is the window/lid attached to the package? Are there any articles or write-ups on how the non hermetic parts are assembled that you can point me to? Thanks again. Tom Terlizzi Terlizzi@gmsystems.com
In reply to TOM TERLIZZI:
We currently offer 7 DMDs that are in a hermetic package (see below)
I am not aware of any documentation regarding the assembly of our Wafer Level Package (WLP) DMDs
thanks for the information on which DLP DMD devices are hermetic
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