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DLP5500: The data sheet says the device is hermetic but the mechanicals say an adhesive is used to seal the device

Part Number: DLP5500

Hi

I am looking for an explanation of the “hermetic sealing process” used for the DLP5500.

The military standards precludes using organic adhesives to hermetically seal a Microcircuit package.

Obviously , this is not a military device but is the adhesive an organic or is a special coating like Atomic

LaYer deposition (ALD) used to obtain true hermeticity. Is the term adhesive to mean something else?

Check the mechanical drawing and there is a note on adhesive.

I am looking at a space application so this requirement is important

Also is there a moisture getter in the package?

Thanks

Tom Terlizzi

GM SYSTEMS

KINGS PARK , NY