Hi
I am looking for an explanation of the “hermetic sealing process” used for the DLP5500.
The military standards precludes using organic adhesives to hermetically seal a Microcircuit package.
Obviously , this is not a military device but is the adhesive an organic or is a special coating like Atomic
LaYer deposition (ALD) used to obtain true hermeticity. Is the term adhesive to mean something else?
Check the mechanical drawing and there is a note on adhesive.
I am looking at a space application so this requirement is important
Also is there a moisture getter in the package?
Thanks
Tom Terlizzi
GM SYSTEMS
KINGS PARK , NY