DLP5500 back side of thermal interface area material

Rossinag

Expert 1705 points

Other Parts Discussed in Thread: DLP5500

Dear All

Thank you for your support.

Is it possible to provide the material information of the back side of DLP5500 thermal interface area ?

In order to consider heat radiation design , my customer is looking for the information.

Thank you and best regards,

Rossinag

over 7 years ago

0 Paul Goedeke over 7 years ago

TI__Mastermind 30600 points

Hi Rossinag,

Sorry for the delay - let me look into this and get back to you.

Paul

0 Paul Goedeke over 7 years ago in reply to Paul Goedeke

TI__Mastermind 30600 points

Rossinag,

The metal pad on the back of the DLP5500 is a symbolization pad (it is made of a gold alloy) and is not intended for thermal dissipation. Most of the heat dissipation occurs through the ceramic package of the device.

Hope this answers your question,
Paul

0 Paul Goedeke over 7 years ago in reply to Paul Goedeke

TI__Mastermind 30600 points

Rossinag,

I wanted to provide some further information on modeling the thermal characteristics of this package.
In the datasheet, Section 8.5 provides the thermal coefficient and section 9.6.3 shows how to calculate the heat to the ceramic. TI has an app note on how to use the thermal coefficient in power calculations: www.ti.com/.../spra953c.pdf

If you'd like to mount a heat sink, we have a reference guide for that as well: www.ti.com/.../dlpa067.pdf

Thanks,
Paul

0 Rossinag over 7 years ago in reply to Paul Goedeke

Expert 1705 points

Hello Paul,
Thank you very much for your kind help.
Based on these information. I will try to explain for my customer.
Best regards,
Rossinag

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DLP5500 back side of thermal interface area material