We're desiging a system to use the DLP3000 chip, and I have not been able to find some specific mechanical information. I'd appreciate it if I could get this information, or even better, a more complete mechanical drawing.
1) What is the thickness of the coverglass
2) What is the position of the active array from the top of the package
3) What is the array tilt tolerance with respect to the mechanical package
Please find my answers below,
1) The window glass thickness is 0.65+/-0.05 mm
2) I am not clear which surface/ view you are calling 'top' but I have mentioned the distance of the active array from the top (side view) in figure below.
3) The Micromirror tilt angle variation is specified in DLP3000 datasheet, "Table 4. Optical Parameters". Are you looking for the additional tolerance between the array and package?
Also, can you help me understand your application?
Thank you for these details. Yes, I'm looking for additional array to mechanical package tolerances. I'm assuming the array position (in the side view) is more tightly toleranced to the datum A than it is to the top of the package? These tolerances will affect our optomechanics design and alignment methodology. Please contact me offline if you wish to discuss.
I have sent you a friend request. We can discuss about your application offline.
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