I am having the following issue with the EVM6670 Lite (TMDSEVM6670L).
Up until now I have used the board in Little-endian mode and ROM Ethernet boot with no issues. When turned on, the DSP would start sending periodic BOOTP packets as expected.
I am now trying to change the mode to Big-endian, thus have set DIP switch 1 of SW3 to Big-Endian mode. The problem is that ROM Ethernet boot doesn't work. I verified with WireShark that BOOTP packets are NOT being sent out by the DSP.
Are there any issues with using ROM Ethernet boot and big-endian mode with the EVM / C66 ? Any ideas why this is happening?
The EVM's FPGA firmware always jumps to EEPROM to execute the PLL fix and return to the original boot mode you have. The PLL fix is in the IBL that is loaded by default in 0x51 of I2C EEPROM. and it is compiled to work only in little endian. So you need to compile the IBL in big endian and load the I2C EEPROM t with the new IBL before you can set the evm in Ethernet boot.
If you need more help, please reply back. If this answers the question,
please click Verify Answer , below.
I followed the instructions in the MCSDK (latest version), rebuilt the IBL in Big Endian, and wrote it to EEPROM according to the instructions.
Now the chip doesn't broadcast any BOOTP packets, both in big and little endian DIP switch configurations.
I compiled again to Little Endian, and wrote to the EEPROM. Still the chip doesn't broadcast any BOOTP packets (this worked in little endian before writing to EEPROM). So the board is non-usable now... can you please advise what could be done?
Did you try the .ccs file in the IBL make directory
The best way to verify that the IBL is loaded correctly is to load POST also compiled in big endian and loaded in EEPROM 0x50. Use the program -evm folder to load back the little endian IBL and POST into the evm.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.