TI E2E Community
Digital Signal Processors (DSP)
C6000 Multicore DSP
Keystone Multicore Forum (C66, 66A, AM5)
Passive Heat Dissipation for C6678
I am working on a custom board with a single C6678. I am looking for a way to use passive cooling to keep the temperature stable. Do you have any suggestions for heat sinks that would not require an external fan? Are there any other alternative approaches that could be used to reduce the heat generated by the DSP?
We don't have a standard heat sink for the C6678. Realistically the cooling solution that you will need will depend heavily on the environment in which the device will be housed and amount of power that the device is consuming. You should calculate the power requirements with the spreadsheet found on the website and review the information in the Thermal Design Guide for Keystone Devices. This should give you enough information to start looking at heat sink solutions.
If you need more help, please reply back. If your question is answered, please click Verify Answer
There is no single answer to this question. The thermal solution must be adapted to your system requirements. Thermal models are provided on the C6678 web page to support this modeling. Modeling will be required for a definative answer. Additionally, the simple ThetaJB and ThetaJC values are contained in the datasheet to support first-order approximations. You can use the Power Estimation spreadsheet (also on the web page) to estimate the maximum heat dissipation for your application. You will then need to identify a heat dissipation solution such as a heat sink that will suffice for the airflow available (whether forced or convective). This is discussed in more detail in the Thermal Design Guide for KeyStone devices on the C6678 web page.
-----------------------------------------------------------------------------------------------------------------------------Please click the Verify Answer button on this post if it answers your question.
You may consider Graphite Foam for this application. See:
Koppers KFOAM (http://www.kfoam.com/mainsite/material.htm)
Poco Graphite (http://www.poco.com/tabid/95/Default.aspx)
Both of these are licensees of technology developed at ORNL:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.