Hello,
I am working on a custom board with a single C6678. I am looking for a way to use passive cooling to keep the temperature stable. Do you have any suggestions for heat sinks that would not require an external fan? Are there any other alternative approaches that could be used to reduce the heat generated by the DSP?
Thanks,
Josh
We don't have a standard heat sink for the C6678. Realistically the cooling solution that you will need will depend heavily on the environment in which the device will be housed and amount of power that the device is consuming. You should calculate the power requirements with the spreadsheet found on the website and review the information in the Thermal Design Guide for Keystone Devices. This should give you enough information to start looking at heat sink solutions.
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Josh,
There is no single answer to this question. The thermal solution must be adapted to your system requirements. Thermal models are provided on the C6678 web page to support this modeling. Modeling will be required for a definative answer. Additionally, the simple ThetaJB and ThetaJC values are contained in the datasheet to support first-order approximations. You can use the Power Estimation spreadsheet (also on the web page) to estimate the maximum heat dissipation for your application. You will then need to identify a heat dissipation solution such as a heat sink that will suffice for the airflow available (whether forced or convective). This is discussed in more detail in the Thermal Design Guide for KeyStone devices on the C6678 web page.
Tom
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Hello Josh,
You may consider Graphite Foam for this application. See:
Koppers KFOAM (http://www.kfoam.com/mainsite/material.htm)
Poco Graphite (http://www.poco.com/tabid/95/Default.aspx)
Both of these are licensees of technology developed at ORNL:
http://www.ornl.gov/adm/partnerships/success_stories/led_foam.shtml
Best Regards,
-bogdan