• Join
  • Sign In with my.TI Login
Texas Instruments
  • Products
  • Applications
  • Tools & Software
  • Support & Community
  • Sample & Buy
  • About TI
Sample & Purchase Cart Sample & Purchase Cart
  • Search
  • Advanced
TI E2E™ Community
  • Support Forums
  • Blogs
  • Groups
  • Videos
  • 简体中文
  • More ...
TI Home » TI E2E Community » Support Forums » Digital Signal Processors (DSP) » C6000 Multicore DSP » Keystone Multicore Forum (C66, 66A, AM5) » Problem about linkerfile in C6670L
Share
C6000 Multicore DSP
  • Forums
  • Announcements
Options
  • Subscribe via RSS
Training Available
TI provides self-paced online training that introduces the primary components of the KeyStone II family of SoC devices.

  • KeyStone II SoC Overview >
  • KeyStone II Software Overview >
  • KeyStone II ARM Cortex-A15 Corepac Overview >
  • More Information >
  • Check out
    Multicore Mix blog
    • $core_v2_blog.Current.Name

      Geeks UNITE for Geek Pride Day

      Posted 2 days ago
      by Lauren Reed1
      Happy Geek Pride Day from the Processors team! We wanted to celebrate...
    • $core_v2_blog.Current.Name

      OpenMP - All aboard!

      Posted 4 days ago
      by Debbie Greenstreet
      With so many end products today relying on multicore DSPs for...
    • $core_v2_blog.Current.Name

      A look back: Two years of Multicore Mix

      Posted 5 days ago
      by Lauren Reed1
      A big thank you to everyone who participated in our contest last...

    Problem about linkerfile in C6670L

    Problem about linkerfile in C6670L

    This question is answered
    ahmed abouzaid
    Posted by ahmed abouzaid
    on Aug 11 2012 09:23 AM
    Intellectual625 points

     Hello;

    I am using Hyperlink interface example that trasfer data from L2SRAM in local device to L2SRAM in remote device.the data segment is placed in DDR3 which is the i/p to core0 So,how to allocate the data to be sent by hperlink interface(o/p from core 0) to L2SRAM memmory before seng it to the remote device.

    there is a liker file i made it so, is there any modification to it ?

    8507.LTE2(1).cmd.txt

    thanks you in advance;

    Report Abuse
    • Reply
    You have posted to a forum that requires a moderator to approve posts before they are publicly available.
    All Replies
    • Chad Courtney
      Posted by Chad Courtney
      on Aug 13 2012 09:10 AM
      Verified Answer
      Verified by ahmed abouzaid
      Mastermind22595 points

      You would need to have a space defined for the Remote Device L2SRAM, and the address should be the translated address.  Just as you would read/write those translatted addresses (which get translated by the hyperlink to their physical address on the remote device.)

      Best Regards,

      Chad

      ------------------------------------------------------------------------------------------------------------

      Please click the Verify Answer button on this post if it answers your question.

      Report Abuse
      • Reply
      You have posted to a forum that requires a moderator to approve posts before they are publicly available.
    TI E2E™ Community
    • Support Forums
    • Blogs
    • Videos
    • Groups
    • Site Support & Feedback
    • Settings
    TI E2E™ Community Groups
    • TI University Program
    • Make the Switch
    • Microcontroller Projects
    • Motor Drive & Control
    Other Communities
    • Deyisupport
    • Designsomething.org
    • beagleboard.org
    • TI on Element 14
    • TI on TechXchangeSM
    Other Technical & Support Resources
    • WEBENCH® Design Center
    • Product Information Centers
    • Technical Documents
    • TI Design Network
    • TI Technical Articles
    • TI Training

    All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.

    Content on this site may contain or be subject to specific guidelines or limitations on use. All postings and use of the content on this site are subject to the Terms of Use of the site; third parties using this content agree to abide by any limitations or guidelines and to comply with the Terms of Use of this site. TI, its suppliers and providers of content reserve the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice.

    Follow Us Texas Instruments on Facebook Texas Instruments on Twitter Texas Instruments on LinkedIn Texas Instruments on Google+
    TI Worldwide | Contact Us | my.TI Login | Site Map | Corporate Citizenship | mobile m.ti.com (Mobile Version)

    TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs and
    embedded processors, along with software, tools and the industry’s largest sales/support staff.

    © Copyright 1995-2013 Texas Instruments Incorporated. All rights reserved.
    Trademarks | Privacy Policy | Terms of Use