I am pleased to announce very fast boot for dm365.It takes 0.5 (half of a second) from kernel initialization (not including u-boot and kernel unzip) till command line prompt.
Download ready uImage with root FS and test it: http://www.makelinux.net/ti/fastboot/
Boot time measured by printing /proc/uptime from boot script.
See also: Booting Linux dm365 Network Camera in 3.2 seconds
Embedded Linux Consulting: http://www.MakeLinux.com/
Linux and TI DaVinci Technology Portal: http://www.Linux-DaVinci.info/
consider to Verify the Answer
When I burned ubl
and uboot on nand flash with small block size (hynix 64MB) using
DM35x_FlashAndBootUtils_1_50 through serial port, I got error message "No
good blocks in allowed range". I used a new nand flash. So please tell me
it is why. thanks a lot.
In reply to YHLShareware:
@Mark/YHLShareware - you probably posted to the wrong topic.
on topic: nice value - according to the wiki there were already several efforts (total boot in less than 1s) in speeding kernel boot up. the overall value from power on until the user can launch its application is in fact the more interesting one. (and its as well dependent on the size of the kernel image to load and unpack, so a sole linux kernel boot value does not tell anything)
In reply to Alexander Stohr:
Time of loading kernel from flash depends from flash type NAND/NOR, throughput, UBL/u-boot configuration and eventually kernel and FS size.
Please read update: Booting Linux dm365 Network Camera in 3.2 seconds
In reply to Constantine:
i want to make a nfs file with busybox1.13.3 on platform DM365.but it can not run the /sbin/init.
if i replace the /sbin/init with the montavista/nfs/sbin/init,it is right.
my cross_compile of busybox is arm-linux-gcc3.3.2.
and my kernel is arm_v5t_le-gcc.
can you tell me why the busybox/sbin/init can not run.
is it the compiler can not match?
and can you tell which kind of busbox should i use to make?
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.