This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • TI Thinks Resolved

DM3730: Thermal considerations

Part Number: DM3730

Hello,

We are using the specified device (DM3730CUSD100) in our application.

Looking at table 3-3 under the OPP130 col for 105C there is no information available, do you have any?

We might have a case where we use the industrial component with junction temperature exceeding 90C (Lets say 92-95C for short time periods - seconds), do you know if the possible damage to the life time of the device is addative? (Other way to ask it if the device only partially works at high junction temperature what are the risks?

Is table 3-3 valid for the extended temperature range or only for the industrial?

Should I worry about using the industrial devices for few seconds at ~95C?

Another question is what is the difference between the extended temp range and the industrial devices? Is it produced in the same line and the difference is tests only?

Thank you.

  • Hi Eli az,

    There is no available additional information about DM3730 device POH life.
    I can not guarantee stable work of an industrial temperature range device when the junction temperature exceeds 90 C.
    The extended temp range device can works up to 105 C junction temperature vs 90 C for industrial.

    BR
    Tsvetolin Shulev
  • In reply to Cvetolin Shulev-XID:

    Hello,

    Can you please elaborate about the differences between the industrial and extended temperature range devices manufacturing process?

    Is the difference derived from tests only or does the manufacturing process different?

    Thank you.

  • In reply to Eli az:

    This is not public information.

    BR
    Tsvetolin Shulev
  • In reply to Cvetolin Shulev-XID:

    Hello,

    I am asking this question because of the difference in the reliability reports over time.

    A few years ago in 2014 I got a reliability report with 3 fails of the industrial device with 0.5keV activation energy.

    The reliability report of the extended temp range now is for 0.7keV.

    This is why I want to know if there are different processes for both or if the upgrade to the extended temp range is transperent?

    Eli.

  • In reply to Eli az:

    Hello,

    Any update?

  • In reply to Cvetolin Shulev-XID:

    Hello,

    I am asking this question because of the difference in the reliability reports over time.

    A few years ago in 2014 I got a reliability report with 3 fails of the industrial device with 0.5keV activation energy.

    The reliability report of the extended temp range now is for 0.7keV.

    This is why I want to know if there are different processes for both or if the upgrade to the extended temp range is transperent?



    Eli.
  • In reply to Eli az:

    Eli

    I'm looking into this and have a question about the note you had above:

    ==
    A few years ago in 2014 I got a reliability report with 3 fails of the industrial device with 0.5keV activation energy.

    The reliability report of the extended temp range now is for 0.7keV.
    ==

    Who provided this report? Is this for the DM3730 device or a system level test? How does this test related to the POH query you have?

    Regards, Siva
  • In reply to sivak:

    Hello,

    The reliability data was taken from TI website.

    The reliability data is for DM3730CUSD100, Usage temp of 55C, 60% Confidence level, 0.5eV activation energy, Test temp of 130C, Test duration of 1000h for 1790 samples with 3 fails.

    The main thing I want to know is what test I have to do changing the industrial temperature range to the extended temperature range.

    If both devices is manufactured in the same process and then sorted so this change in device temperature range is transparent.

    Currently my application is heating too much and I can keep the industrial temperature range.

    Eli.

  • In reply to Eli az:

    Eli

    Thanks for the information. As noted in the data sheet, for the Extended Temperature range, the OPP130 or OPP1G mode is not supported. There could be differences in the test and screen flow between the different temperature grade parts and I would not recommending using a lower grade temperature part in place of a higher temperature grade part even if it is transient in nature.

    A practical solution to the issue you are having could be to use some sort of thermal throttling - i.e. cool down the system using DVFS, turn off any unused peripherals etc. If these are not an option, you would have to look other options at system level to cool down the part to meet the data sheet specifications.

    Let us know if you have any other follow-up questions.

    Regards, Siva
  • In reply to sivak:

    Eli

    Do you have any other questions here?

    Regards, Siva

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.