Does TI have an update as to when they expect to release silicon revision 1.2 (device revision "B") to the full spec DM3730B version for all 3 packages (CBP, CBC, CUS)? Currently released as pre-production XDM3730B. Also, does TI have plans to offer all 3 packages in extended temp option? If so, when do they plan to release to production?
Hi Wayne,
Please note that most (except for extended temp) production quality (TMS) rev 1.2 parts have been released in mid-October and are orderable; these parts have no letter denoting the rev since these are the first full spec production quality parts (e.g. DM3730CUS). We do plan on offering extended temp on all three packages per the following schedule. •PG 1.2 TMX pre-production where rev is denoted by B (XDM3730B<package>). order entry open, start shipping dec10'-Jan11' •PG 1.2 TMS (DM37xx<package>) order entry open, start shipping Jan11’ •PG 1.2 TMS extended temp (DM37xx<package>A ) order entry expected to open Dec10' w/ shipments starting March11’
•PG 1.2 TMX pre-production where rev is denoted by B (XDM3730B<package>). order entry open, start shipping dec10'-Jan11'
•PG 1.2 TMS (DM37xx<package>) order entry open, start shipping Jan11’
•PG 1.2 TMS extended temp (DM37xx<package>A ) order entry expected to open Dec10' w/ shipments starting March11’
Let us know if this helps clear things up!