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NSMD Pad or SMD

Regarding the DM3730CBPD100:

This part is a 0.4mm pitch, 515 pin sBGA. My question is does TI recommend that the footprint for this part be designed to have the BGA balls collapse around the pads (which would require a NSMD pad) or that it does not (which would then signify a SMD pad)?

You do not show a recommended footprint so I wanted to ask. We have been using this part with a good degree of success (using NSMD) but I have been reading articles that have conflicting recommendations and just wanted to know what TI recommends.

Thank you!!