[J5Eco] is there any recommended heak sink for J5Eco ?

Hi Machida,

See if the below pointers will be in help:

e2e.ti.com/.../218165
e2e.ti.com/.../170040
e2e.ti.com/.../1180853
e2e.ti.com/.../186052

Regards,
Pavel

Hi Pavel,

Thank you for your reply.
I have two questions.

- 1 -
Thank you for providing useful URL.
Viet-san showed following document in following URL.
www.ti.com/.../spra953b.pdf
e2e.ti.com/.../218165

It seems that this topic is for Centaurus(DM814x), but I would like u to confirm whether I can provide this doc for J5Eco user as well.

- 2 -
My customer just want to know whether there is any manufacturer or product which TI can recommend when they need to use heat sink.
Do you know any information about heat sink manufacturer or product for J5Eco ?

Best Regards,
Machida

Ryuichi Machida said:

It seems that this topic is for Centaurus(DM814x), but I would like u to confirm whether I can provide this doc for J5Eco user as well.

The app note is applicable for J5Eco and all SoC’s.

Ryuichi Machida said:

My customer just want to know whether there is any manufacturer or product which TI can recommend when they need to use heat sink.
Do you know any information about heat sink manufacturer or product for J5Eco ?

The selection of heat sink will depend on the application requirements (e.g., height of fins, adhesion material and/or locking mechanism, etc.).  We have not used a heat sink on any of the TI boards for GS70 products (Centaurus, J5Eco, etc.).  The closest point of comparison would be the OMAP5432 uEVM, which does include a heat-sink on the SoC.

Also DM816x TI EVM has heat sink which should be also applicable for J5Eco if needed.

Regards,
Pavel

See also the below wiki page (this is for AM335x, but should be applicable for other devices also):

processors.wiki.ti.com/.../AM335x_Thermal_Considerations

Regards,
Pavel

The heat sink used in OMAP5432 uEVM is:

HEATSINK:
CTS
BDN10-3CB/A01
Thermal Tape