DM8148 Furnace temperature curve

Hi Bobby,

I never heard or see such manuals. Where you have found info that there are such manuals?

BR
Pavel

Hi Pavel,

no, TI has it, its name may be "Soldering Information" or "Reflow profile" or "Reflow soldering" or "Wave soldering".
The factory must know it to solder the chip on board.
please kindly to discuss inner TI.

Regards,
Bobby

Bobby,

I will contact the team with your request. I will let you know their feedback.

BR
Pavel

Bobby,

Regarding "The DDR target impedance curve for PI simulator", this is what we have:

We don’t have DDR target impedance curves. Instead, we recommend follow the data manual layout guidelines which are simulated/validated by TI.

Regarding "DM8148 Furnace temperature curve" and “reflow profile”, still waiting for feedback.

BR
Pavel

Bobby,

In the below link you will find our PBGA app note which contains general recommendation on a reflow profile that follows the JEDEC standard. This is applicable to the DM814x device.

www.ti.com/.../ssza002b.pdf

BR
Pavel

Thanks Pavel, But I can’t find a matching package to the DM8148.

The Dm8148 is 23 x 23 mm FCBGA 684-Pin BGA (CYE) 

I don’t see any 684 balls device listed in this doc, and no CYE type (I’m not sure what is the difference between PBGA and FCBGA).

If this is the correct doc?

Regards,

Bobby

The doc is general, and is applicable also to DM814x device

Hi Pavel,

The document lists several types according to the size and number of BGA pins.
Please tell me which one I should refer in this list?
Thanks!

Regards,
Bobby