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TMS320C6713B: About Baking Condition

yimin bai34
Genius 4755 points
Part Number: TMS320C6713B

Hi Sir 

we would like to follow J_STD_033B.1 to do baking in 125 degrees for 48 hours.

for C6713 

Device Size (mm) Pitch (mm) No. of Pins Package Designator
C6713 30.00 x 30.00 mm 0.5 mm 208 PYP
27.00 x 27.00 mm 1.27 mm 272 GDP

we have read below document and found some information in Table 5

  www.ti.com/.../snoa550e.pdf

It said as below 

         For BGA package types >17x17 mm, stacked die packages, or packages with thickness > 4.5 mm, please contact your local TI sales representative.

Could TI advise the baking conditions for C6713 IC ? 

BR

Yimin

  • 0
    TI__Guru 65405 points
    Hi Yimin,

    The team is notified. They will post their feedback directly here.

    BR
    Tsvetolin Shulev
  • 0
    TI__Mastermind 29210 points

    Hi Yimin,

    All TI packages went through MSL qualification based on JEDEC J-STD-020E.

    The spec include a reflow profile as a general guideline.

    Individual reflow profile has to be optimized based on PCB thickness, component density and type of solder paste being used. The customer should consider all these conditions and refer to solder paste supplier recommended profile as reference.

    GDP is a 27X27mm, 272 balls PBGA. TI has a general Application Notes which include PCB layout and reflow guideline. Please find it here: http://www.ti.com/lit/an/ssza002b/ssza002b.pdf

    PYP is a 30 X 30mm, 208 pins QFP. It has a thermal pad of 7.545 X 7.545mm.

    This is a standard industrial package. The reflow profile just follows J-STD-020E as shown below.

    Hope this helps,
    Mark

  • 0 in reply to Mark Mckeown
    Genius 4755 points
    Hi Sir

    If we want to do baking , what is the standard for C6713 ?
    Can we do baking in 125 degrees for 48 hours ?

    BR
    Yimin
  • 0 in reply to yimin bai34
    TI__Mastermind 29210 points

    Hi Yimin,

    Baking conditions are based on devices MSL, thickness then follow JEDEC-J-STD-033C.

    Assuming worst case that the package already exceed floor life > 72 hrs.

    GDP package is MSL3-220C, Thickness is 1.78mm - Should be baked at 125C for 27 hours.

    PYP package is MSL4-260C, Thickness is 1.6mm - Should be baked at 125C for 34 hours.

    See below table for reference.

    Hope this helps,
    Mark