We want to use DSPLIB for our OMAP-L138/Zoom EVM and WinCE 6.0. I downloaded the 674x version and noticed that it's compatible with CCS and Linux. I don't have the big picture as to how WinCE can build and use it. Is it tied to DSPBIOS/LINK? What's the process? Where is the documentation?
DSPLIB is a DSP-side library - details, including a link to the user's guide, are on this page:
It's completely independent of DSP Link and WinCE, though you can use all those components on your OMAP-L138 device (WinCE on the ARM, BIOS and DSPLIB on the DSP, DSP Link for ARM<->DSP communication ).
Thanks for answering my post. I did look at your link, and it did talk about DSP functions, but it left several unanswered issues. I'm not there yet, but I understand that I need to use CCS to "configure" the DSP side of the OMAP-L138. I did download the DSPLIB, and it says it's compatible with CCS and Linux, so a few questions because I'm new to the OMAP system:
1) Is the library a plug-in for CCS or does CCS just call it's library functions?
2) If I'm using WinCE, what's the process for building and using the library? Does the library become part of the CCS build that's downloaded to the DSP to configure it, then I would call it's functions via DSPLINK from the ARM?
3) What version of CCS would you recommend?
4) Do the versions of DSPBIOS/LINK and DSPLIB depend on the version of CCS? If so, which versions of those 2 would you recommend? CCS4 was included in our LogicPD Zoom EVM for the OMAP.
Obviously, I'm in the big picture and how-to stage of things. Step-by-step is a good way to approach this I think since the overall system is fairly complicated, and there are many documents scattered many places.
I just sketched this up to help with the big picture. You need to write the app (orange) on both sides, and your DSP-side app may decide to invoke the fxns in dsplib (red).
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.