I am trying to use the build in the musb driver and use the omapl1x glue layer.
I'm in kernel version 3.19, and i see that from version 3.08 to 3.09 they removed the option for this glue layer from the musb menuconfig by adding 'depends on broken' to the musb kconfig? Does anyone know why? Should we not try to use this driver?
Even when i delete the extra dependency and build the glue layer into my kernel, i don't see any printk's that i added to the glue layer probe function in the kernel output on boot.
This driver and its corresponding glue layer are what is called in the da850evm (omapl138lcdk)? It seems that it does a good job of setting up the necessary registers during the probe function. Is this driver now obselete, if so which should I try to use for omapl138 part?
Thanks,
Dan