OMap 137 DSPLink Wince Problem

This question is answered

Posted by Kelvin Tan

on Sep 11 2010 18:30 PM

I am a beginner in OMAP/DSP environment and currently i'm trying to build a WINCE 6.0 OS image for Omap 137 evaluation board. By following the installation guide for Omap L1xxx, i am able to compile all gpp and dsp source code and sample files. The delta is the tools i use are new versions than what's listed in the installation guide. The tools i use are

1. GCTools v6.1.17, instead of 6.1.14

2. DSP/BIOS v5.33.05

3. Wince 6.0 VS 2005 + platform builder R3, instead of R2

4. Pearl.

I am able to build NK.bin with dsplinkk.dll successfully. however, when the evaluation board is boot up (from SD card), the OS is loaded up and dsplink is loaded and sends up whole bunch of 'garbage' (i observed it from Hyperterminal) and ActiveSync can't connect to the device. At this point, the board is basically unusable.

I'm not sure the problem is. Can anyone give me some advice? THanks so much in advance

All Replies

Posted by Jatin Jain

on Sep 13 2010 11:08 AM

Suggested Answer

Expert7250 points

We strongly suggest that you try with the documented (TI) tool versions first to make sure that your baseline/procedure is correct before you change the tools version. That way the problem can be narrowed down better. (WinCE R3 should be okay. No need to change that to R2).

---

Posted by Kelvin Tan

on Sep 13 2010 11:14 AM

Verified Answer

Verified by Jatin Jain

Prodigy40 points

Jatin,

Thanks for the response. It turned out the SOC type was not setup correctly in BSP. it's now working after the correct SOC is selected.

Thanks.

TI E2E™ Community

TI E2E™ Community Groups

Other Communities

Other Technical & Support Resources

All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.

Content on this site may contain or be subject to specific guidelines or limitations on use. All postings and use of the content on this site are subject to the Terms of Use of the site; third parties using this content agree to abide by any limitations or guidelines and to comply with the Terms of Use of this site. TI, its suppliers and providers of content reserve the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice.

m.ti.com (Mobile Version)

TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs and
embedded processors, along with software, tools and the industry’s largest sales/support staff.