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What type of protection on the VBUS do you recommend for the USB (3.0/3.1/3.2) Type C connector ?
In previous USB 2.0 Designs we have used a Littlefuse PGB1010603 PULSE-GUARD® ESD Suppressors
We are using both the TI TPD6S300 and TI TPD2S300 to protect the other USB Type C signals !
I believe the question you're asking was answered in a previous thread, which can be found here: https://e2e.ti.com/support/interface/circuit-protection/f/389/t/650941.
I recommend placing high-speed ESD diodes (TPD1E5B04DPYR) on each USB3.1 channels. Feel free to look at one of our PD controller EVM schematic, such as the TPS65981-EVM. Page 23 of the user's guide shows the connection of these ESD diodes on the Type-C connector (look below):
It's also recommended to place a Schottky diode and a 0.1uF cap on each VBUS channel.
Lastly, I don't beleive you need both the TPD6s300 and TPD2s300. You would need just one of these protection devices per Type-C port.
TPD2s300: CCx protection
TPD6s300: CCx, SBUx, and one USB2.0 channel protection
TPD8s300: CCx, SBUx, and both USB2.0 channel protection
If this answers your question, PLEASE select This resolved my issue
Aramis P. Alvarez
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In reply to Aramis P. Alvarez:
Thank you so much for this reply, it has helped me a lot in getting a better understanding of the circuit protection requirements. I am now looking at the schematic of the TPS65981-EVM and seeing there is a lot more protection on that board that what I have planned !
Firstly we are NOT going to be using \ designing USB PD. To get enough power we have planned to use 2 Type C connectors one for Communication and power and the 2nd connector solely for additional power. This explains why we are using both the the TPD6s300 and TPD2s300.
1. I see that there are Schottky diodes D4-D10, & D12 on the Tx\Rx lines ! For my non-PD design is this required \ recommended ?
2. In the HD3SS3220 data sheet they mention using "the TI TPD4EUSB30 can be combined with the TI TPD2EUSB30 to provide flow-through ESD protection for both USB2 and USB3 differential signals". (This probably answers my above question ?) WHen I looked at these data sheets they are for USB 3.0 as expected. Would it be better to use a similar device but that give protection for USB 3.1 since we might go to that in the future ? Thus we will only need to stock 1 device if it is compatible with both 3.0 & 3.1 ?! What do you recommend ? Would, lets say TPD4E02B04-Q1 be a better choice ?
3. We will be using the FTDI FT601 chip to do the interfacing to the USB 3.0 bus. In our previous USB 2.0 design FTDI recommended also PulseGuard ESD Suppressors - PGB1010603 on the USB 2.0 DP/DM signals as well as 10pF Caps to GND. When I asked them about this requirement for this design using the FT601 they claimed that it was necessary as a different PHY is being used. When I looked at the data sheet for the FT601 ESD and Latch-up Specifications :-
Human Body Mode (HBM) - JEDEC EIA/JESD22- A114-B, Class 2 - ±2kV
Machine mode (MM) - JEDEC EIA/JESD22- A115-A, Class B - ±200V
Charged Device Mode (CDM) - JEDEC EIA/ JESD22-C101- D, Class-III - ±500V
Latch-up JESD78, Trigger Class-II - ±200mA
In your opinion is this enough ? In the TPD4E02B04-Q1 data sheet they recommend on the USB 2.0 lines to use TPD4E05U06-Q1 ? What do you think ?
In reply to Shmuel Davis:
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