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TPD4E1U06: Place issue

Part Number: TPD4E1U06
Other Parts Discussed in Thread: STRIKE

Hi Sirs,

Sorry to bother you.

We are survey Ethernet ESD solution and we saw TPD4E1U06.

For layout  note from TI doc (slva680) looks ESD is close to the connect, right?

But for Intel and competitor reference, looks it's close to the transceiver.

It's confuse us how to place. Could you share your experience for us? Thanks!!

 

  • Hello,

    The best thing to do is to keep the protection device close to the connector because that is where the faults are going to occur.

    What you're showing is just two schematics, in their layout they will put it close to the connector.

    Regards,
    Cameron
  • Hi Cameron,

    Thanks for your reply, still have some questions that listed below:

    1)      Please let us know the proper location is case1 or case2?  

    Case1: RJ45 CONN -> ESD diode -> LAN Transformer -> Ethernet IC

    Case2: RJ45 CONN -> LAN Transformer -> ESD diode -> Ethernet IC

    2)      Ex: TPD4E1U06 @case1, we wonder the result if pin2(GND) is floating(no connection).

    We should keep its GND pin as NC, because the reason of Hi-POT test requests….

    May we know any change on CL/CCROSS/CIO-TO-GND if pin2 is floating? Will its value increase or decrease?

    How about the ESD test performance if leave pin2 NC?

    Or which part would you suggest us to use for case1?

  • Hello,

    Use case 1 would be the correct one if you are trying to protect the LAN Transformer.

    I do not understand how leaving the ground pin floating would protect anything. At that point you are connecting one end of diode and leaving the other end open. If you have and ESD strike it will just charge up the whole board because it has no way to dissipate it.

    Regards,
    Cameron