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TPD4E1B06: Device Leakage Issue

Part Number: TPD4E1B06

Support Path: /Product/Development and troubleshooting/

We have an issue where the TPD4E1B06DCKR TVS diode device seems to go leaky when heated  to 50 degrees with power applied. Where it is physically on the PCB it is mounted very close to a PTH connector which is hand soldered with RA type resin solder. RMA SMT type solder is used on the device, both no clean, and the connector has been brushed. We believe it is not necessarily the device but some reaction between the two fluxes and maybe something on the outside of the device. When we lift the devices off the board the issue disappears once its legs have left the solder pads but when we test the device it appears fine. If we put the device back on the board the issue sometimes comes back after a few days.To get the issue to occur requires baking at 55 degrees with power applied for 100 hours. Conformal coating before hand soldering seems to solve the problem but we do not understand the problem and any help or ideas would be appreciated.

  • Stephen,

    When you say power is applied  to the board what do you mean? Are the channels of the TPD4E1B06 all at 5V? Could you send me a schematic to my email c-phillips@ti.com?

    Also what is the leakage that you are measuring? And what is the application that this device is being used in?

    Regards,
    Cameron