/etc... Interface
Options

TPD12S520

TPD12S520

This question is not answered
Rak
Posted by
on Dec 13 2011 17:37 PM
Intellectual290 points

Hello,

My customer is interested in TPD12S520.

But, they would like to know the followings.  

1) Clamping voltage and time in case of discharging +/-8kV ESD

2) Clamping voltage in case that discharge voltage is varied from +/-8kV to +/-12kV

3) Leakage current after discharging ESD 100 times (0 to 12kV)

4) HDMI wave form (eye pattern) after discharging ESD

Is it possible to provide such data ?

Thank you in advance for your help.

 

Best regards,

Rak

 

Report Abuse
All Replies
  • Vivek Shankar
    Posted by
    on Dec 21 2011 10:02 AM
    Intellectual2130 points

    Rak,

    1) Clamping voltage and time in case of discharging +/-8kV ESD

    We have listed the clamping voltage in case of HBM stresses on the datasheet (page 6). I dont have the clamping voltage data for 8kV at this time. If this is very important to the customer, I can schedule this data to be collected and updated. Please inform me if this is mandatory.

     2) Clamping voltage in case that discharge voltage is varied from +/-8kV to +/-12kV

    Are we talking about airgap esd? The measurements would depend on the testing technique. 

    3) Leakage current after discharging ESD 100 times (0 to 12kV)

    The leakage current is not expected to change significantly due to multiple ESD strikes. The Datasheet limits are sufficient

    4) HDMI wave form (eye pattern) after discharging ESD

    The eye pattern has been included in the datasheet (page 7). The data is not expected to change significantly post esd-stress.

    If you have any further questions, please feel free to include it in this forum. 

    Thanks

    Vivek

    Vivek Shankar
    Applications Engineer
    Integrated Protection Devices
    Texas Instruments Inc.
    Report Abuse

All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.

Content on this site may contain or be subject to specific guidelines or limitations on use. All postings and use of the content on this site are subject to the Terms of Use of the site; third parties using this content agree to abide by any limitations or guidelines and to comply with the Terms of Use of this site. TI, its suppliers and providers of content reserve the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice.

TI Worldwide | Contact Us | my.TI Login | Site Map | Corporate Citizenship | mobile m.ti.com (Mobile Version)

TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs and
embedded processors, along with software, tools and the industry’s largest sales/support staff.

© Copyright 1995-2013 Texas Instruments Incorporated. All rights reserved.
Trademarks | Privacy Policy | Terms of Use