This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Question about Hot-swap

Hello, everyone.

I'm Byoungkil from KOREA.

I have two questions about signal-integrity for hot-swap application.

1. In TI document(SCEA026-Logic in Live-Insertion Applications With a Focus on GTLP), 4 isolation levels for hot-swap.

If our designed board has hot-swap controller and is used GTLP device(level3-live insertion) as a backplane trnasceiver.
in order to guarantee live-insertion, additional software coding is required?

2. There are SN74LVC4245s as a backplane bus transceiver in our system. Because board signal level is 3.3V and backplane signal level is 5V. and I would like to provide level 3(live-insertion).

In TI document(page8, SZZA033Power-Up 3-State Circuits in TI Standard), there are sentences about SN74LVC4245. If we offer that power-up sequence, signal-integrity is guaranteed at the hot-swap situation? OR software coding for hot-swap is required?

 

Thanks,

Byoungkil.

 

 

  • GTLP parts will have a bias VCC that makes them level 3 compatable. There is no special software coding needed. The coding needed will be in the connector the connector will need different length pins so gnd will touch first then Bias Vcc  then I/Os then Vcc.

    The SN74LVC4245 is level 0 live insertion. We do not have any level 3 live insertion parts in out group.

    I will move this post to the translation forum to see if they have anything

  • SN74LVC4245 is level-0?

    I knew that is level-1.

    Anyway, TI don't have level-3 transceivers with dual Vcc, right?