Hello, everyone.
I'm Byoungkil from KOREA.
I have two questions about signal-integrity for hot-swap application.
1. In TI document(SCEA026-Logic in Live-Insertion Applications With a Focus on GTLP), 4 isolation levels for hot-swap.
If our designed board has hot-swap controller and is used GTLP device(level3-live insertion) as a backplane trnasceiver.
in order to guarantee live-insertion, additional software coding is required?
2. There are SN74LVC4245s as a backplane bus transceiver in our system. Because board signal level is 3.3V and backplane signal level is 5V. and I would like to provide level 3(live-insertion).
In TI document(page8, SZZA033Power-Up 3-State Circuits in TI Standard), there are sentences about SN74LVC4245. If we offer that power-up sequence, signal-integrity is guaranteed at the hot-swap situation? OR software coding for hot-swap is required?
Thanks,
Byoungkil.