Datasheet: http://www.ti.com/lit/ds/symlink/dp83848vyb.pdf
Design & Layout Application Note: http://www.ti.com/lit/an/snla079d/snla079d.pdf
1. What is the purpose of grounding the shield of the RJ45 connector since it is not connected to anything?
2. Application Note: In figure 2.2, the bob-smith termination is grounded to signal ground - but in section 2.3 it says to ground the bob-smith termination to chassis ground, which one is correct ?
3. Application Note: in section 6.2 equation 1, what does 'crystal load spec' correspond to in the crystal datasheet? is it the 'load capacitance' of the crystal?
4. Application Note: in section 6.2, what value resistor should I use in series with the crystal if the crystal I want to use has drive level of 10 uW (typical) - 200uW (max.) ? Should I just pick a new crystal?
5. Application Note: in section 10.1 table 2 how do we calculate parameter 'load capacitance' ? crystal load capacitance + C1 + C2 ?
I know it's alot of questions but anything helps, thank you guys so much!
