MAX3232: RθJC

Hi Jeff,

I do not think its an apples to apples comparison between the E and non E version of the device because the on die protection circuits are different causing one die to be larger than the other. I am going to submit a thermal modeling request for the MAX3232 and will follow up with you when I have all of the data.

Hi Jeff,

I should have asked this earlier so sorry for the duplicate email, what package are you looking at? I will assume D (SOIC) for now to get the request started and will change it if you update me a different package option.

Hi Jeff,

Here is the thermal information for the D package:

Ambient Temperature      25

Result- Theta JA-High K 66.6

Result-Theta JC, top       32.4

Result-Theta JB               31.9

Result- Psi JT                   8.4

Result- Psi JB                   31.5

I am still waiting on the other packages and will respond when I have it. Also, I will see about updating the existing datasheet to include this information.

Hi Jeff,

I submitted the rest of the package options all at once to get the thermal information so this may take a bit longer. As soon as I have the information I will post it here and I am working on updating the datasheet now.

Hi Jeff,

Sorry for the delay. Attached are the thermal metrics for all packages of the MAX3232 device. Please let me know what else you need?

MAX3232 Thermal Metrics.pdf

Hi Jeff,

The thermal parameters are the same for the C and I versions of the devices. SO the PW thermals for both C and I are:

Thermal Metric	MAX3232PW	Unit
TA	25	C
RϴJA	101.1	˚C/W
RϴJCtop	32.9
RϴJB	47.5
ΨJT	1.9
ΨJB	46.9

Please let me know what other questions you have?