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Part Number: SN65HVD379
We submitted five samples of Lot # 6662992ML6 date code 1623 to Destructive Physical Analysis per MIL-STD-1580B w/change 3 and two parts were identified with thinning metal on metal layers 1 and 2. Can you confirm for me that the metal thickness for those layers met the design target? It would also be helpful to know if the lots processed before and after this lot were on target. These parts were purchased from Digikey, and the cross-section measured in the analysis was prepared without decapping the device. Thanks!
I will discuss this with our component quality department and get back to you next week.
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In reply to Max Robertson:
Thanks Max, Matt
In reply to Matthew Barsotti:
The feedback I received is that TI’s EP and Standard Products are not subject to the requirements outlined in MIL SPEC documents. Wafer lot cross section acceptance is not a requirement for non-QML product. For details on how TI’s process control process, see section 13 of our General Quality Guidelines entitled “Process Monitoring/Product Assurance”. General Quality Guidelines can be found at: http://www.ti.com/lit/ml/szzq076m/szzq076m.pdf.
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