Hello team,
I wanted to get some information from you on the TUSB4041IPAPR's sensitivity to the ground pad connection. I would like to know how much solder coverage of the epad, as a function of the PCB’s epad landing size, is needed for the following landing sizes:
- Option 1: The epad landing area is 4.06 mm x 4.06 mm
- Option 2: The epad landing area is 4.44 mm x 4.44 mm
I already know the stencil thickness requirement for these as per the datasheet, but the coverage% required that a MFG team would use to reject a part is not shown.
Thank you in advance for your support!
Errol