This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TUSB4041I: Ground Pad Solder Coverage %

Part Number: TUSB4041I

Hello team,

I wanted to get some information from you on the TUSB4041IPAPR's sensitivity to the ground pad connection. I would like to know how much solder coverage of the epad, as a function of the PCB’s epad landing size, is needed for the following landing sizes:

  • Option 1: The epad landing area is 4.06 mm x 4.06 mm 
  • Option 2: The epad landing area is 4.44 mm x 4.44 mm

I already know the stencil thickness requirement for these as per the datasheet, but the coverage% required that a MFG team would use to reject a part is not shown.

Thank you in advance for your support!

Errol