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DS26F31MQML: state of the output after crash

Part Number: DS26F31MQML

Hello.

Could you please explain,

what will be the state of the DS26F31MQML outputs (A1, A2, B1, B2, C1, C2, D1, D2) in case, after IC is broken by overvoltage, by overheating, by heavy particle impact, etc?

  • Hello Slava,

    When there is overstress failure, the most typical electrical signature is a low impedance from the stressed IO to GND.  However, the unpredictable nature of IC failure mechanisms make it difficult to ensure that the IO would fail in this manner under any potential stress condition.  And, it is possible for a primary failure to result in other behaviors such as heating of the die that could then induce further secondary failures in similarly unpredictable ways.

    Regards,
    Max

  • Hello Max,

    Does this mean that it is impossible to predict the results of the IC damage in a given situation and that TI can't guarantee that if the IC fails (by any reason) the output will not be shorted to ground?

    If so, what the chematic design solution for organizing a cold reserve can you advise in order to accurately ensure the operation of the differential channel based on DS26F31MQML?

  • Kirill,

    Yes, you are correct - we can advise on most likely failure modes but there isn't a way to ensure them in all cases.  The best solution is to avoid over-stress failures by keeping operation within the limits defined by the device datasheet.  For IOs interfacing to external ports, a common approach is to use a TVS diode in order to clamp any voltage excursions to within an allowed range.  Depending on the expected stress, other protection schemes could be used as well.

    Here is some info on how to choose a TVS diode for interface devices in order to protect from transient stresses like ESD:

    https://e2e.ti.com/blogs_/b/industrial_strength/archive/2017/11/13/how-to-choose-a-tvs-diode-for-rs-232-rs-485-and-can-based-on-voltage-ratings

    For protecting against DC stresses such as short-circuit conditions (e.g., due to miswirings), you could reference this reference design:

    http://www.ti.com/lit/ug/tiduer9/tiduer9.pdf

    Regards,
    Max