I am Raju from India.
On my embeded board, have DVI out port (from TFP410). I want to connect my LCD panel (LP154W01-A5) to board via DVI to LVDS bridge.
LCD panel configuration is as follows.
Color depth: 6 - bit, 262,144 colors
Pixel Pitch: 0.25875 mm × 0.25875 mm
Can I use TI two chip DVI to LVDS bridge (TFP401a-ep as DVI Rx and SN75LVDS83B as LVDS Tx) solution for this.
If yes, could you please provide me the schematic for DVI Rx (TFP401a-ep).
Hi Raju, see these documents. The second one isn't for the TFP401A-EP exactly, but it still applies.
Thanks for the reply.
I assume, TFP401A-EP and SN75LVDS83B combination will be suitable for my LCD panel (LP154W01-A5).
Could you please confirm on this.
I will defer to Ross on the technical aspects on if the combination will work with your panel.
However, I noticed you are using the -EP version of the TFP410A. This is the enhanced plastic package typical for hi-reliability applications (speced for -55 to +125C operation). The SN75LVDS83B is only speced for commercail temperature (0 to +70 C) operation so from a "temperature" basis, this seems to be a mis-match, If you need extended temperature range, the SN65LVDS93A is the same functionality and performance as the LVDS83B, only it is speced for industrial temperature (-45 to +85 C operation). On the other hand if commercial tempearture is fine, then the TFP410A is available in commercial temperature options for less than half the cost.
Raju, I took a look at that panel and it looks fine. The SN75LVDS83B is commonly used with 1280x800 panels.
Dan brings up a good point, that you might also consider using the SN65LVDS93A--the same device with a wider temperature range.
Thanks for the clarification. I will go with chips which supports commercial temperature range.
I have prepared schematic for this HDMI/DVI to LVDS Bridge. Here I attached document.
Could you please review it and provide me your suggestions or modifications.
I have reviewed the schematic and found two issues:
1) /STAG pin on the TFP401A should be tied high.2) Since they are selecting OCK_INV=low on the TFP401A, they should also connect CLKSEL=low on the LVDS83B.
Also, please check the document on the below link for design recommendations.
Hi ELIAS VILLEGAS,
1) Connected STAG# to VCC_3.3V through 10K resistor.
2) Pulled down CLKSEL to ground through 1K resistor.
I used NXP "PCA9633DP1" IC as Back-light controller.
Is there any IC from TI, which suitable for the same operation?
I found "TLC59108F". But, LED control outputs are Active low and I looking for Active high.
Could you please suggest me the suitable IC from TI.
May I have any update on this.
I am not familiar with back light controllers, but you may want to visit the below link.
After long time, I am posting question on this again. Sorry for the long gap
From Design recommendation document (http://www.ti.com/lit/an/slla136/slla136.pdf), we should use 22uF, 0.01uF capacitors for DVDD, OVDD, AVDD and PVCC.
But I used 10uF, 0.01uF capacitors. Based on following document.
Could you please confirm on this. I mean, need to change my design or I can go with it.
There should be not a big issue.
Hi Elias Villegas,
What are specification for Ferrite beads which are user to connect to OVDD, AVDD, DVDD and PVDD pins on TFP401A IC.
That usually depends on the power supply used, but the evaluation module for the TFP401 uses a 600ohm, 200mA @100MHz ferrite bead.
I used 3.3V to connect these pins.
Shell I proceed with 600ohm, 200mA @100MHz ferrite bead?
Well, I was talking more about the quality of the power supply, but yes, I think that ferrite bead should be fine.
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