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XIO3130 heat sink

JosefMieslinger
Intellectual 2170 points
Other Parts Discussed in Thread: XIO3130

Hi Team,

my customer is using XIO3130 and wants to use a heat sink to cool the device:

He raised following questions:

- They want to use a ThermoPAD to connect the heat sink - what is the max force the PAD is allowed to put on the package

- Is there a guideline where to put holes/screws for the heat sink (distance from package, force balanced on the package)

- Are the any limitations thermal where to contact the package with the heat sink.

Thanks!