DS90LV011A: Thermal resistance θjc

Hello Lee-san,

Sorry, with my PC, I can't see the data (picture data?) you attached inline the article.
I'm sorry to trouble you, but could you please write "in text format" again?

Best regards,
M. Tachibana

THERMAL METRIC(1)		DBV (5 Pins)	UNIT
RθJA	Junction-to-ambient thermal resistance	191.6	°C/W
RθJC(top)	Junction-to-case (top) thermal resistance	141.4	°C/W
RθJB	Junction-to-board thermal resistance	44.5	°C/W
ψJT	Junction-to-top characterization parameter	34.5	°C/W
ψJB	Junction-to-board characterization parameter	43.9	°C/W
RθJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

Hi,

The DS90LV011A datasheet has not been updated.  Here is a thermal report from another product using the SOT-23-5 package.

Regards,

Lee

Hello Lee-san,

Thank yor for your information.

But the thermal resistance values you taught me are not that of DS90LV011A.
I think that the values of the thermal resistance will vary if the size of the die is different.
Is it OK to use these values as that of DS90LV011A even if these values are another product's?

Best regards,
M. Tachibana

Hello Lee-san,

Thank you for your reply.
I understood that the thermal resistance is not significantly affected by the die size in small packages.
I'll use these value for DS90LV011A.

Best regards,
M. Tachibana