Hello team,
Hope you are well and enjoying the holidays. Please see below customer question
We want to optimize the paste mask for : PCF8574RGTR (VQFN package)
The datasheet states: "84% printed solder coverage by area under package"
Questions specifically for exposed die pad:
Is this the recommended paste mask coverage pre-assembly?
If so; what is the allowable void area post assembly?
Is this per IPC specification?
Regards,
Randhir