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TRS3122E: About changing diameter of VIA

Tao_2199
Genius 5660 points
Part Number: TRS3122E

Hello,

 

Regarding to land pattern on TRS3122E, my customer is asking a question.

They will design diameter 0.2mm as VIA from datasheet page 27.

But they will change it to 0.1 mm because of PCB manufacturing finally.

(Question)

In this case, is there any thermal problem on their condition?

Their condition is TA=80℃.

 

Regards,

Tao2199

  • 0
    TI__Guru 62910 points
    Hello Tao,

    I would not expect an issue with this. The 0.1-mm vias will still provide some path for thermal conduction, and generally the power dissipation of TRS3122E is not so high that heating is a large concern. If they wanted, the customer may be able to improve thermal conduction by increasing the number of vias to compensate for the smaller diameter. In any case, they should make sure that the solder stencil thickness/layout is determined properly based on the via field so that the pad makes good contact to the PCB. It may need to be adjusted from our datasheet's recommendation if the via properties change, and whoever is responsible for PCB fab should be able to give some guidance on this based on manufacturing concerns.

    Max