On another support thread a TI engineer suggested potentially stacking multiple digital isolators to achieve higher isolation voltages:
As the voltage experienced by each one off the isolators would be directly proportional to their impedance we worry about unbalances.
Thus, some questions:
1. Are the impedances of these chips somewhat controlled? (this would give us a window of fluctuation)
2. Do you have some data on the tests performed doing that?
3. How would the powering work? Do the isolated power supplies have even higher impedance than the isolator chips? Or would they be the weakest link?
What about the ISOW7840? I imagine that one would not supply enough power to power a second unit, would it?
This could potentially be huge for us if we indeed could do that. Thus, I hope you can help.