• Resolved

CD4050B: Bond heating and Flow soldering

Part Number: CD4050B

Dear Specialists,

My customer is considering to adopt CD4050BPWR and has a question.

I would be grateful if you could advise.

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We'd like to CD4050PWR, but we have a concern about mount condition.

Because we will need to process preform bond heating and wave (flow) soldering.

Regarding flow solder, according to application note SNOA040B, it seems to be OK.

In this case, it needs to perform with bond heating and flow soldering.

Could you advise whether with bond heating and wave soldering is possible or not for CD4050BPWR ?

I'm happy to know the thermal limit of bond heating. (example it needs to be below Tjmax)

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I appreciate your great help in advance.

Best regards,

Shinichi

  • Hello Shinichi-san,
    I will look into this and get back to you.


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  • In reply to Emrys Maier:

    Hi Emrys,

    Thank you for your reply.

    In this case,
    As far as I see other threads, the TSSOP package seems to be able to withstand WAVE solder.
    I want you to comment whether there is no problem.

    Regarding the bond hardening profile slightly exceeds the absolute maximum rated storage temperature of the peak 150 ° C, and confirmation is necessary.
    If it is not acceptable, please let me know what degrees can be handled.

    I'm looking forward to waiting your reply.

    I appreciate your great help and cooperation.

    Best regards,
    Shinichi
  • In reply to Shinichi1:

    TI has tested wave solder viability, however we do not guarantee results.

    • Results of TI wave solder study

    –        Units were tested in accordance with the published JESD22-A111A standardized test for wave soldering which outlines the acceptable temperature profiles and methodology in evaluating wave solder performance.  However, due to wave soldering process variations, board design, and adhesive properties, the results may vary.

    –        We strongly encourage our customers to perform their own evaluation to verify component compatibility in their lead-free wave soldering process.  Any tests performed by TI may not be fully representative of our end customers’ process; therefore any information shared is not a guarantee of performance.

    –        All units passed electrical test after wave solder with little or no electrical degradation.

    –        The intent of the TI wave solder study was not to qualify the flow. – It was to show viability.

    –        TI has determined that “the tested devices are” viable for wave solder per JESD22-A111A.

    –        Additional wave soldering information is available at  http://www.ti.com/lit/an/scea041/scea041.pdf


    Looking for a low voltage translator? Check out the AXC family that supports 0.7V to 3.3V translation!

    The Logic Minute training page has videos on many interesting topics that all are kept shorter than 5 minutes.

  • In reply to Emrys Maier:

    Hi Emrys,

    Thank you for your reply.

    I understand TSSOP package is for viable wave soldering.

    I really appreciate your grerat help.

    On the other hand, I'd like to confirm the bond hardening profile.

    I have to respond to the customer whether this condition(160deg peak and  within 100sec) can be met or indicate substitute condition.

    I'm sorry to let you go through all this.

    I'm looking forward to seeing you.

    Best regards,

    Shinichi

  • In reply to Shinichi1:

    Hello Shinichi-san,

    Can you describe "bond hardening" -- what is this?

    I don't see any problem with 160C for 100s. The device is rated for storage at 150C (indefinitely), and can be subjected to 260C for a short time for reflow soldering.


    Looking for a low voltage translator? Check out the AXC family that supports 0.7V to 3.3V translation!

    The Logic Minute training page has videos on many interesting topics that all are kept shorter than 5 minutes.

  • In reply to Emrys Maier:

    Hi Emrys,

    Thank you for your reply.

    Since flow solder is jointed by blowing solder, it will come off if it is not bonded.

    That is, when flow soldering is performed, bonding is necessary.

    The condition(260deg 10sec) of bonding was presented from customer.

    In this case, it was impossible to judge whether or not the condition of 160 ° C. 10 seconds could be tolerated.

    As you mentioned, it is sufficiently lower than 260 deg of reflow, so is it possible to judge that there is no problem?

    I appreciate your great help.

    Best regards,
    Shinichi
  • In reply to Shinichi1:

    Hi Shinichi-san,
    We strongly encourage our customers to perform their own evaluation to verify component compatibility for unique manufacturing processes like this.

    I don't think there will be a problem.


    Looking for a low voltage translator? Check out the AXC family that supports 0.7V to 3.3V translation!

    The Logic Minute training page has videos on many interesting topics that all are kept shorter than 5 minutes.

  • In reply to Emrys Maier:

    Hi Emrys,

    Thank you for your reply.

    You are right !

    I'll share your suggestion with the customer and make them consider.

    I appreciate your great help and cooperation.

    If he has an additional question, I consult you again.

    Best regards,

    Shinichi