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YZP stencil opening

 I'm using the SN74LVC1G80Y.  In the link below for the YZP package TI recommends a .225 mm diameter pad and a .3 mm square stencil opening. This seems very large and will deposit solder outside the diameter of the pad. Is TI still recommending these dimensions?

www.ti.com/.../scet007b.pdf

Thanks,

Bob