Hi,
So i realize NiPdAu plated leads have been around for lots of years however my experience has been mostly in the LEAD processing and really didn't see much issue related to wetting / side fillets.
Currently were running many of these devices using SAC305 WS T4 solder paste. The profile were using is a very flux friendly with a 50 second soak (150-217C) and 240C peak reflow.
Overall wetting is a concern. Side fillet length is ok but height is 50% at best, heel fillet is ok but again the solder just doesn't seem to flow well to the lead. Basically the lead looks like its sitting on top of the solder joint.
Do you have a recommendation on particular LF WW solder paste chemistries that works well with this plating, or from a profile standpoint is there anything in particular i should be considering?
Thanks for your time